Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com


Infineon Technologies AG articles

Displaying 1 - 136 of 136

Light-triggered thyristor features integrated protection

Light-triggered thyristor features integrated protection
An optically triggered thyristor that can improve the reliability, lower the system cost and simplify the design of ultra-high-power applications has been introduced by Infineon Technologies. The 6” thyristor incorporates reliable optical triggering, eliminating the requirement for an external electrical trigger circuit. In addition, on-board safety features such as overvoltage protection, dv/dt protection and protection against forward voltage transients during recovery time further reduce component count and design complexity.
21st May 2015

MOSFETs offer a 50% reduction in turn-off losses

Infineon Technologies has launched a new family of CoolMOS C7 series superjunction MOSFETs. The 600V series offers a 50% reduction in turn-off losses compared to the CoolMOS CP, offering a GaN-like level of performance in PFC, TTF and other hard-switching topologies. 
19th May 2015

IPMs for wind, solar & industrial drives on display at PCIM

At this year's PCIM 2015 trade show Infineon Technologies will launch a new Intelligent Power Module (IPM). The MIPAQ Pro provides an all-in-one solution for a wide spectrum of scalable and compact inverter designs to be implemented in wind, solar and industrial drives applications. The MIPAQ Pro is a fully qualified and tested IPM, integrating IGBTs, gate drivers, the heat sink, sensors, digital control electronics as well as digital bus communication in one robust and reliable device. 
18th May 2015


Power modules combine IGBT5 & .XT interconnection technology

Power modules combine IGBT5 & .XT interconnection technology
At PCIM 2015, Infineon Technologies will present the latest generation of its PrimePACK power modules, which benefit from the new generation of Infineon’s IGBTs. The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies.
13th May 2015

3D magnetic sensor reduces power consumption

3D magnetic sensor reduces power consumption
Featuring highly accurate 3D sensing with extremely low power consumption, the TLV493D-A1B6 3D magnetic sensor has been introduced by Infineon Technologies. Magnetic field detection in x, y and z axes allows the sensor to reliably measure 3D linear and rotation movements, while the implemented digital I²C interface enables fast and bidirectional communication between sensor and MCU.
12th May 2015

PCIM to host combined expertise of Infineon & IR

PCIM to host combined expertise of Infineon & IR
PCIM 2015 will pay host, for the first time in Europe, to the combined power portfolio of Infineon and International Rectifier, in hall 9, booth 412, from 19th to 21st May 2015. The result of Infineon's strategic approach, outlined as “from product thinking to system understanding,” the company's range of products includes MOSFETs, IGBTs, GaN devices and speciality materials.
11th May 2015

Infineon strengthens home appliance market position

It has been announced that Infineon Technologies has purchased all outstanding shares of LS Power Semitech. The strategic acquisition increases Infineon’s global footprint in the growing market segment of Intelligent Power Modules (IPM) which enable higher energy efficiency in consumer appliances such as refrigerators, freezers, washing machines, dryers and air conditioners.
7th May 2015

Package progress for high current densities

Package progress for high current densities
  The first packages for power semiconductors were very large, difficult to process and a challenge to cool well. Infineon has created the TO-Leadless power package for high-current applications. Ralf Walter, Infineon Technologies explains.
6th May 2015

Security platform achieves common criteria certification

Security platform achieves common criteria certification
Infineon has announced that its OPTIGA TPM (Trusted Platform Module) with SPI (Serial Peripheral Interface) has achieved Common Criteria Certification EAL4+, enabling system manufacturers to distinguish and select trustworthy solutions based on internationally recognised, independent testing. The certificate was presented by the Federal Office for Information Security (known as BSI) at the RSA conference in San Francisco.
23rd April 2015

Infineon supports the trend for more robust semiconductors

Supporting the trend from relay to more robust semiconductor solutions, Infineon Technologies has released its HITFET+ family of protected low-side switches. The HITFET+ family offers a compelling feature-set with its diagnosis function, digital status feedback and short-circuit robustness, and controlled slew rate adjustment for easily balancing switching losses and EMC compliance. 
23rd April 2015

Infineon demonstrates how it supports secure Industry 4.0

Microelectronics is the key enabling technology for Industry 4.0, the networked production of the future. At the Hannover Messe, Infineon Technologies demonstrates how it supports a secure Industry 4.0.
15th April 2015

AEC-Q100 qualified MCUs integrate on-chip EtherCAT

AEC-Q100 qualified MCUs integrate on-chip EtherCAT
Infineon has utilised the Hanover Messe to announce its XMC4800 series of 32-bit MCUs with on-chip EtherCAT (Ethernet for Control Automation Technology) node. With its real-time capability, the XMC4800 series will drive networked industrial automation and Industry 4.0 applications. AEC Q100 qualified, the MCUs are suited for applications in commercial, construction and agricultural vehicles.
15th April 2015

GaN platforms are enhancement mode & cascode configured

Infineon Technologies has announced the expansion of its Gallium Nitride (GaN)-on-Silicon technology and product portfolio. The company now offers both enhancement mode and cascode configuration GaN-based platforms optimised for high performance applications requiring superior levels of energy efficiency including Switch Mode Power Supplies (SMPS) used in servers and telecomms, and consumer goods such as Class D Audio systems. GaN technology significantly reduces the size and weight of power supplies which will open up new opportunities in end-products such as ultra-thin LED TVs.
18th March 2015

MOSFETs target cloud & IoT applications

Infineon Technologies has introduced the OptiMOS 5 25V and 30V product family, the next generation of power MOSFETs in standard discrete packages, a new class of power stages named Power Block, and in an integrated power stage, DrMOS 5x5.
13th March 2015

Infineon Technologies & Panasonic to develop GaN devices

Infineon Technologies and Panasonic have announced an agreement under which both companies will jointly develop Gallium nitride (GaN) devices based on Panasonic’s normally-off (enhancement mode) GaN on silicon transistor structure integrated into Infineon’s SMD packages. In this context Panasonic has provided Infineon with a license of its normally-off GaN transistor structure. 
10th March 2015

Embedded secure element chip enables Samsung Galaxy S6

Infineon Technologies has announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge. Infineon’s SLE 97 is a SOLID FLASH-based eSE chip which can safeguard the functionalities of the mobile device as well as transactions where users’ sensitive data such as payment credentials are concerned.
3rd March 2015

Secure elements meet smartphone & wearable security needs

Secure elements meet smartphone & wearable security needs
Infineon Technologies has introduced embedded security controllers for premium handsets and smart wearables at Mobile World Congress 2015. The latest SOLID FLASH-based SLE 97 controllers provide what is claimed to be the industry’s highest memory capacity of up to 1.5MB in ultra-small packages.
2nd March 2015

Barometric pressure sensor delivers ±5cm resolution

Barometric pressure sensor delivers ±5cm resolution
Designed for use in mobile and wearable gadgets and IoT devices, Infineon Technologies has announced an ultra-high ±5cm resolution, miniature MEMS pressure sensor. The DPS310 is a low-power digital barometric pressure sensor that enables the development of new and enhanced navigation, location, well-being, gesture recognition and weather monitoring applications.
26th February 2015

Virtual engineer tool aims to cut embedded development time

Virtual engineer tool aims to cut embedded development time
At this year's embedded world, Infineon has announced the latest version of its development platform DAVE, the “Digital Application Virtual Engineer” for its 32-bit MCU families XMC1000 and XMC4000. Infineon has equipped DAVE so that the development time for embedded systems on the basis of the XMC MCUs is reduced due to efficient, component-based software development.
24th February 2015

Infineon ships over 1bn TVS diodes in WLL packages in 2014

Infineon ships over 1bn TVS diodes in WLL packages in 2014
Infineon Technologies has announced that more than 1bn ultra-small TVS diodes in the company’s bare silicon WLL package were delivered to customers in 2014. TVS diodes in WLL packages are used in applications where miniaturisation is a priority, including touch screen and keypad interfaces and the increasingly popular high-speed data ports used in mobile electronics.
24th February 2015


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