Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.


Infineon Technologies AG articles

Displaying 1 - 20 of 199

LED driver ICs have flicker-free control

LED driver ICs have flicker-free control
Preparing for smart lighting, Infineon introduces the XDPL8220 LED driver IC. Primary side control saves extra components, says the company, reducing cost while increasing reliability.
20th September 2016

CIPURSE payment options speed ferry boarding

CIPURSE payment options speed ferry boarding
Passengers taking the Pierce County Ferry in Washington State are not only traversing the lower Puget Sound conveniently, they are also the first in the U.S. to enjoy fully electronic ticketing based on the CIPURSE open standard for electronic fare collection. The operator, HMS Ferries, now enables customers to purchase QR-code tickets on their smartphones, online or at the ticket booth at the Steilacoom Terminal, which speeds up the boarding procedure.
15th September 2016

MOSFET sets efficiency and thermal performance benchmark

MOSFET sets efficiency and thermal performance benchmark
Based on super junction technology, the CoolMOS P7 series of 800V MOSFETs can be used for low power SMPS applications, focusing on flyback topologies typically found in applications like adapter, LED lighting, audio, industrial and auxiliary power.
9th September 2016


ESCRYPT & GlobalSign join Infineon Security Partner Network

ESCRYPT & GlobalSign join Infineon Security Partner Network
The Infineon Security Partner Network (ISPN) welcomes new partners with the addition of ESCRYPT Embedded Security and GlobalSign, who both offer dedicated security solutions for Industry 4.0 applications based on OPTIGA Trusted Platform Modules (TPMs). The ISPN is a network of leading security players who offer hardware-based security to IoT device manufacturers and service providers.
1st September 2016

Infineon security chips enable world’s first NFC payment ring

Infineon security chips enable world’s first NFC payment ring
NFCRing has introduced the world's first EMVCo compliant payment ring based on a contactless security chip from Infineon Technologies. The tiny, water-proof smart wearable works like a contactless payment card. Users can pay by simply holding their finger with the ring closely to any EMVCo contactless-enabled payment terminal. The ring uses NFC technology to communicate data over short distances of a few centimetres.
23rd August 2016

Infineon chips strengthen security at Korean airports

Infineon chips strengthen security at Korean airports
Strengthening airport access control systems for its personnel, Korea Airports Corporation (KAC) has implemented a new security solution based on the CIPURSE security standard. Infineon Technologies supplies the security chips for the electronic access control cards handed out to the staff at three of the 14 Korean civil aviation airports managed by KAC. Additional airports are to follow successively.
11th August 2016

Highly integrated Hall sensors reduce system costs

Highly integrated Hall sensors reduce system costs
A family of Hall sensors introduced by Infineon Technologies enable automotive, industrial and consumer electronics to meet strict environmental standards. They will also help fulfil the requirements of very cost-effective and compact designs. Available as latch and switch-type sensors, the TLx496x family Hall sensors are highly integrated, have precise switching points, a stable operation and a low power consumption.
4th August 2016

50mm thyristor/diode modules 25% less expensive

50mm thyristor/diode modules 25% less expensive
With the introduction of a 50mm module, Infineon Technologies AG extends its product portfolio of thyristor/diode modules in solder bond technology. These bipolar modules address the growing market for cost-effective solutions even in demanding applications. Depending on the module, market prices are approximately 25% lower than comparable pressure contact variants. 
29th July 2016

Infineon to acquire Wolfspeed for $850m in cash

Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and RF division (“Wolfspeed”) of Cree. The deal also includes the related SiC wafer substrate business for power and RF power. The purchase price for this planned all-cash transaction is $850m (approximately €740m). This acquisition will enable Infineon to provide the broadest offering in compound semiconductors and will further strengthen Infineon as a leading supplier of power and RF power solutions in high-growth markets such as electro-mobility, renewables and next-gen cellular infrastructure relevant for IoT.
14th July 2016

Improving Europe’s industrial policy on cybersecurity

Infineon Technologies takes an active role in the development of European-level cybersecurity guidelines. The European Commission has signed the contract for a Public-Private-Partnership (PPP) with the European Cyber Security Organisation (ECSO) ASBL. Representing the private sector, ECSO will work directly with the European Commission to improve Europe’s industrial policy on cybersecurity.
6th July 2016

Synchronous rectification ICs simplify SMPS applications

Synchronous rectification ICs simplify SMPS applications
  Expanding the company's product offering for SMPS applications, Infineon announces the  IR1161L and IR11688S Secondary Synchronous Rectification (SSR) controller ICs.
28th June 2016

World's smallest 3D camera brings AR to a smartphone

World's smallest 3D camera brings AR to a smartphone
Lenovo is the first manufacturer worldwide to bring Tango technology to a consumer product. Google's technology that allows devices to understand spatial information is an exclusive feature in the PHAB2 Pro smartphone launched today. Based on the Time-of-Flight principle, the REAL3 image sensor chip from Infineon equips the smartphone with a 3-dimensional perception of the surroundings in real-time.
13th June 2016

“SemI40” strengthens Europe’s economy with the “learning factory”

The research project SemI40 (“Power Semiconductor and Electronics Manufacturing 4.0”) led by Infineon Austria was launched recently. In this project 37 partners from five countries will carry out research into further developing autonomous factories. The common goal is the next stage in the development of  Industry 4.0 applications. With a volume of €62m, the research project is one of the largest Industry 4.0 projects in Europe.
1st June 2016

Google & Infineon advance gesture control partnership

Google & Infineon advance gesture control partnership
For the first time, two prototypes of products controlled exclusively through gestures were demonstrated at Google I/O: a smartwatch and a wireless speaker. Both devices can recognise gestures that replace switches or buttons with this revolutionary concept, which was enabled by technology from Infineon Technologies and Google ATAP.
20th May 2016

Infineon launches "Internet of Sensors" pilot project

Infineon Technologies has launched what it claims to be one of the most important European pilot line projects for sensors and sensor systems at its Dresden site. The project name, IoSense, is derived from the “Internet of Sensors”. The IoT will require vast quantities of sensors in order to succeed. Cost-effective production of sensor systems is, therefore, a key prerequisite as they enable devices and systems to capture and process the properties of the physical world.
19th May 2016

650V MOSFET delivers high performance with a small footprint

650V MOSFET delivers high performance with a small footprint
Expanding its CoolMOS family, Infineon Technologies has introduced the CoolMOS C7 Gold 650V in a TO-Leadless package. This combination of improved superjunction semiconductor process and advanced SMD package design is delivering unparallelled performance in hard switching applications. The small footprint of this package brings power density advantages for server, telecomms and solar applications.
13th May 2016

Power modules save space in H/EVs

Power modules save space in H/EVs
Power modules from Infineon for hybrid and electric vehicles (H/EVs) meet challenges presented by CO2 regulations to meet targets of 95g CO2 /km in Europe, 121g/km in the US, 117g/km in China and 105g/km in Japan by 2020. The HybridPack Double Sided Cooling (DSC) power modules for H/EVs measure 42 x 42.4 x 4.77mm.
13th May 2016

Kit provides easy entry into digital power control

Kit provides easy entry into digital power control
Infineon Technologies and Würth Elektronik present an easy and affordable entry into digital power control applications. The Digital Power Explorer Kit was developed for analogue power supply designers and embedded software programmers to help them better understand and implement the capabilities of digital power control based on standard MCUs.
11th May 2016

SiC MOSFET exploit SiC performance

SiC MOSFET exploit SiC performance
Maximising the performance characteristics of SiC, Infineon has announced it is sampling 1,200V SiC MOSFETS. The CoolSiC MOSFETs are available in three- and four- pin package options and improve dynamic loses, especially at high currents.
11th May 2016

Compact gate drivers feature increased creepage distance

Compact gate drivers feature increased creepage distance
  Infineon has added a number of wide body package options to its EiceDRIVER Compact galvanically isolated gate driver IC family. The 7.62mm (0.3") 1EDI Compact devices are supplied in a DSO-8 package offering increased creepage distances and improved thermal behaviour.
9th May 2016


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