Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.


Infineon Technologies AG articles

Displaying 1 - 20 of 186

Google & Infineon advance gesture control partnership

Google & Infineon advance gesture control partnership
For the first time, two prototypes of products controlled exclusively through gestures were demonstrated at Google I/O: a smartwatch and a wireless speaker. Both devices can recognise gestures that replace switches or buttons with this revolutionary concept, which was enabled by technology from Infineon Technologies and Google ATAP.
20th May 2016

Infineon launches "Internet of Sensors" pilot project

Infineon Technologies has launched what it claims to be one of the most important European pilot line projects for sensors and sensor systems at its Dresden site. The project name, IoSense, is derived from the “Internet of Sensors”. The IoT will require vast quantities of sensors in order to succeed. Cost-effective production of sensor systems is, therefore, a key prerequisite as they enable devices and systems to capture and process the properties of the physical world.
19th May 2016

650V MOSFET delivers high performance with a small footprint

650V MOSFET delivers high performance with a small footprint
Expanding its CoolMOS family, Infineon Technologies has introduced the CoolMOS C7 Gold 650V in a TO-Leadless package. This combination of improved superjunction semiconductor process and advanced SMD package design is delivering unparallelled performance in hard switching applications. The small footprint of this package brings power density advantages for server, telecomms and solar applications.
13th May 2016


Power modules save space in H/EVs

Power modules save space in H/EVs
Power modules from Infineon for hybrid and electric vehicles (H/EVs) meet challenges presented by CO2 regulations to meet targets of 95g CO2 /km in Europe, 121g/km in the US, 117g/km in China and 105g/km in Japan by 2020. The HybridPack Double Sided Cooling (DSC) power modules for H/EVs measure 42 x 42.4 x 4.77mm.
13th May 2016

Kit provides easy entry into digital power control

Kit provides easy entry into digital power control
Infineon Technologies and Würth Elektronik present an easy and affordable entry into digital power control applications. The Digital Power Explorer Kit was developed for analogue power supply designers and embedded software programmers to help them better understand and implement the capabilities of digital power control based on standard MCUs.
11th May 2016

SiC MOSFET exploit SiC performance

SiC MOSFET exploit SiC performance
Maximising the performance characteristics of SiC, Infineon has announced it is sampling 1,200V SiC MOSFETS. The CoolSiC MOSFETs are available in three- and four- pin package options and improve dynamic loses, especially at high currents.
11th May 2016

Compact gate drivers feature increased creepage distance

Compact gate drivers feature increased creepage distance
  Infineon has added a number of wide body package options to its EiceDRIVER Compact galvanically isolated gate driver IC family. The 7.62mm (0.3") 1EDI Compact devices are supplied in a DSO-8 package offering increased creepage distances and improved thermal behaviour.
9th May 2016

Evaluation kit enables fast & easy motor drive design

Evaluation kit enables fast & easy motor drive design
Offering a scalable design platform for 3-phase motor drives in the 20 to 300W range, Infineon announces its iMotion Modular Application Design Kit (MADK). The compact and flexible evaluation system includes controller and power boards (optionally with sensors). Using the kit, a full functioning motor system will be running in less than one hour, enabling a faster time-to-market.
6th May 2016

MOSFETs offer flexibility to increase efficiency & frequency

MOSFETs offer flexibility to increase efficiency & frequency
Infineon Technologies announces SiC MOSFET technology which allows product designs to achieve previously unattainable levels of power density and performance. Infineon’s CoolSiC MOSFETs offer a new degree of flexibility for increasing efficiency and frequency. They will help developers of power conversion schemes to save space and weight, reduce cooling requirements, improve reliability and lower system costs.
4th May 2016

Discrete IGBT provides high energy efficiency & reliability

Discrete IGBT provides high energy efficiency & reliability
Infineon Technologies has introduced a discrete 600V TRENCHSTOP Performance IGBT which provides high energy efficiency and reliability at a competitive price point for applications such as air conditioning, PV inverters, drives and UPS. Based on Infineon’s TRENCHSTOP technology, the IGBT is optimised for hard switching topologies working at frequencies of up to 30kHz.
3rd May 2016

TO-220 FullPAK Wide Creepage package eliminates workarounds

TO-220 FullPAK Wide Creepage package eliminates workarounds
Infineon Technologies has introduced the TO-220 FullPAK Wide Creepage package, offered for the 600V CoolMOS CE MOSFETs which target a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.
27th April 2016

Infineon sensor chips help CERN to detect dark matter

Infineon sensor chips help CERN to detect dark matter
95% of the universe is still considered unexplored. Scientists at CERN, the world’s largest particle physics research centre, are working on solving these mysteries. In May 2012, researchers there discovered the so-called Higgs Boson, whose prediction won Peter Higgs and François Englert the Nobel prize in physics.
26th April 2016

Packaging improves thermal performance

Packaging improves thermal performance
The SOT-223 package allows for a 10% cost reduction, in comparison to DPAK, writes Rene Mente, Infineon Technologies. The SOT-223 is a direct pin-to-pin replacement for DPAK designs with slightly reduced thermal behaviour in comparison to DPAK.
8th April 2016

ThinkPad notebooks to be equipped with OPTIGA TPM chips

ThinkPad notebooks to be equipped with OPTIGA TPM chips
Infineon Technologies will be equipping the lastest Lenovo ThinkPad ntoebooks with OPTIGA TPM (Trusted Platform Module) chips. The PC manufacturer thus responds to an increase of networking and associated security risks. In recent years, Lenovo has sold more than 100m notebooks from the successful ThinkPad family.
5th April 2016

Reducing power and simplifying design

Reducing power and simplifying design
A new integrated power stage family from Infineon Technologies features a power efficiency rating reaching 96%. This means the power stage devices can be combined with Infineon’s generation digital PWM power management controllers. This provides a full multi-phase voltage regulation (VR) system solution for server, storage client and communications systems.
23rd March 2016

Digital PoL regulators enable FPGA development platform

Digital PoL regulators enable FPGA development platform
Infineon Technologies has announced that its digital PoL DC/DC regulators with full PMBus capabilities are featured in the Kintex UltraScale development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the company's IR3806x family. Configurations can be stored in internal memory and PMBus commands allow run-time control, fault status and telemetry.
21st March 2016

SOT-223 package saves space in low power dissipation design

SOT-223 package saves space in low power dissipation design
Designed as a drop-in replacement for its DPAK package, Infineon offers its CoolMOS CE, high voltage MOSFET in a SOT-23 package. It is, says the company, a cost-effective alternative and offers space savings in some designs with low power dissipation. The SOT-223 package, without middle pin, is compatible with a typical DPAK footprint and can be used as a drop-in replacement and targets designs in LED lighting and mobile charger applications.
14th March 2016

How to save the equivalent of Sweden’s annual power consumption

World Energy Efficiency Day, 5th March, aims to increase public awareness of the misuse of energy and give it the importance it merits. A host of useful ideas for saving energy are circulated for the day each year from simply switching off the light to new efficiency innovations. Infineon Technologies shows how a new technology turns household power guzzlers into true efficiency wonders.
4th March 2016

MCUs provide cost-sensitive power control

MCUs provide cost-sensitive power control
The XMC1400 MCUs will open up applications for Infineon Technologies in industrial automation, digital power conversion and electronic control. In comparison with the earlier XMC1000 products, the XMC1400 series offers greater control performance and additional connectivity.
24th February 2016

Welcome to the smartphone of tomorrow!

Unlike conventional mobile phones, smartphones are no longer primarily communication devices, but also tools for entertainment and work. Users run more and more applications in parallel, their smartphones constantly need to boost their performance. At Mobile World Congress in Barcelona, Infineon Technologies will present new solutions that make smartphones more powerful and more energy-efficient.
17th February 2016


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