Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com


Infineon Technologies AG articles

Displaying 1 - 121 of 121

Embedded secure element chip enables Samsung Galaxy S6

Infineon Technologies has announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge. Infineon’s SLE 97 is a SOLID FLASH-based eSE chip which can safeguard the functionalities of the mobile device as well as transactions where users’ sensitive data such as payment credentials are concerned.
3rd March 2015

Secure elements meet smartphone & wearable security needs

Secure elements meet smartphone & wearable security needs
Infineon Technologies has introduced embedded security controllers for premium handsets and smart wearables at Mobile World Congress 2015. The latest SOLID FLASH-based SLE 97 controllers provide what is claimed to be the industry’s highest memory capacity of up to 1.5MB in ultra-small packages.
2nd March 2015

Barometric pressure sensor delivers ±5cm resolution

Barometric pressure sensor delivers ±5cm resolution
Designed for use in mobile and wearable gadgets and IoT devices, Infineon Technologies has announced an ultra-high ±5cm resolution, miniature MEMS pressure sensor. The DPS310 is a low-power digital barometric pressure sensor that enables the development of new and enhanced navigation, location, well-being, gesture recognition and weather monitoring applications.
26th February 2015


Virtual engineer tool aims to cut embedded development time

Virtual engineer tool aims to cut embedded development time
At this year's embedded world, Infineon has announced the latest version of its development platform DAVE, the “Digital Application Virtual Engineer” for its 32-bit MCU families XMC1000 and XMC4000. Infineon has equipped DAVE so that the development time for embedded systems on the basis of the XMC MCUs is reduced due to efficient, component-based software development.
24th February 2015

Infineon ships over 1bn TVS diodes in WLL packages in 2014

Infineon ships over 1bn TVS diodes in WLL packages in 2014
Infineon Technologies has announced that more than 1bn ultra-small TVS diodes in the company’s bare silicon WLL package were delivered to customers in 2014. TVS diodes in WLL packages are used in applications where miniaturisation is a priority, including touch screen and keypad interfaces and the increasingly popular high-speed data ports used in mobile electronics.
24th February 2015

Microsoft selects Infineon's security controller for tablet

Microsoft has selected the OPTIGA Trusted Platform Module (TPM) security controller, developed by Infineon Technologies, for use within its Surface Pro 3 tablet. With the emergence of IoT, security solutions are of particular importance. The Trusted Computing Group, an international industry standards group, defined the TPM specifications to enable a Root of Trust for security applications. The OPTIGA TPM security controller supports a wide range of security needs ranging from strong authentication to platform integrity checks.
6th February 2015

Power MOSFETs provide reduced RDS(ON), output & gate charges

Infineon Technologies has added 80 and 100V variants to its OptiMOS 5 power MOSFET portfolio. These next-gen Power MOSFETs are optimised for high switching frequencies, especially used in synchronous rectification applications for telecomms and server power supplies, as well as in industrial applications such as solar, low voltage drives and power adapters.
5th February 2015

Infineon still among world's most sustainable companies

For the fifth consecutive time, Infineon Technologies has been included in the Sustainability Yearbook by the Swiss investment company RobecoSAM, ranking them among the world’s 15% most sustainable companies.
20th January 2015

Infineon successfully acquires IR

Infineon successfully acquires IR
  Infineon has announced that it has closed the acquisition of International Rectifier, which has become part of Infineon following the approval of all necessary regulatory authorities and IR’s shareholders.
13th January 2015

Hardware-based security for connected systems

Hardware-based security for connected systems
  Why connected systems require hardware-based security. By Juergen Spaenkuch, Division Vice President Chip Card & Security at Infineon Technologies.
12th January 2015

Members of Infineon's board standing for re-election

At the Annual General Meeting on 12th February 2015 in Munich, the current members on the capital side of the Supervisory Board of Infineon Technologies will be standing for re-election. The capital side of the Supervisory Board is currently represented by Wolfgang Mayrhuber, Hans-Ulrich Holdenried, Prof. Dr. Renate Köcher, Dr. Manfred Puffer, Prof. Dr. rer. nat. Doris Schmitt-Landsiedel and Dr. Eckart Sünner.
19th December 2014

USB token is Google Security Key compatible

 Allowing users to reduce the complexity of password-based log-on to services, and strengthen protection against unauthorised access, Infineon has released security chips and Fast IDentity Online (FIDO)-Ready authenticator reference designs.
10th December 2014

Platforms address emerging IGBT requirements

Platforms address emerging IGBT requirements
Designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV, two power module platforms have been released by Infineon Technologies. Currently, the power module platforms are suitable for 3.3, 4.5, and 6.5kV IGBTs measuring 100x140x40mm. 
10th December 2014

Arduino shields enable RGB lighting & motor control

Arduino shields enable RGB lighting & motor control
  Compatible with the Arduino Uno R3, two shields have been announced by Infineon Technologies for RGB lighting and motor control applications. Both shields can be combined with the XMC1100 Boot Kit which is equipped with a 32-bit MCU from the XMC1000 family.
8th December 2014

Infineon acquires 9.4% of Schweizer

Infineon Technologies has announced that it will acquire a 9.4% stake in Schweizer Electronic. The relevant contracts were concluded today with both companies agreeing on strict confidentiality regarding the terms.
26th November 2014

Power modules provide a low transient thermal resistance

Power modules provide a low transient thermal resistance
To address the specific requirements of cost-effective applications, Infineon Technologies has released bipolar power modules in solder bond technology. The PowerBlock modules expand the company’s power module portfolio which, thus far, was only using pressure contacts. Infineon offers optimised solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by cost and/or performance restrictions.
25th November 2014

IGBT enables more compact product designs

IGBT enables more compact product designs
  The TO-247PLUS package has been introduced by Infineon Technologies, expanding its discrete IGBT portfolio for high power applications. The package, which has the same footprint and pin-out as JEDEC standard TO-247-3, enables up to 120A IGBT co-packed with a full rated diode.
24th November 2014

Integrated bridge drivers enable smart motor control

Integrated bridge drivers enable smart motor control
To address the growing trend towards intelligent motor control, Infineon Technologies has introduced the ARM-based Embedded Power family of bridge drivers at electronica 2014. Claimed to be an industry first, the drivers feature a high-performance MCU powered by the ARM Cortex-M3 processor, NVM, analogue and mixed signal peripherals, communication interfaces and MOSFET gate drivers.
12th November 2014

IGBT package improves power density & reduces system costs

IGBT package improves power density & reduces system costs
Addressing the need for increased power density and space saving in applications requiring high efficiency, Infineon Technologies has released a variant of the TO-247 package. The TO-247 4 Kelvin-Sense package provides efficiency levels previously unavailable when used together with the company’s TRENCHSTOP 5 IGBT and Rapid diode technologies. 
4th November 2014

CoM simplifies manufacture of dual interface cards

CoM simplifies manufacture of dual interface cards
  Designed for official documents, the Dual Interface CoM (Coil on Module) package technology has been released by Infineon Technologies. The manufacture of Dual Interface electronic identification cards, electronic drivers’ licenses or health insurance cards is simplified by the technology.
30th October 2014


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