Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.


Infineon Technologies AG articles

Displaying 1 - 20 of 177

Discrete IGBT provides high energy efficiency & reliability

Discrete IGBT provides high energy efficiency & reliability
Infineon Technologies has introduced a discrete 600V TRENCHSTOP Performance IGBT which provides high energy efficiency and reliability at a competitive price point for applications such as air conditioning, PV inverters, drives and UPS. Based on Infineon’s TRENCHSTOP technology, the IGBT is optimised for hard switching topologies working at frequencies of up to 30kHz.
3rd May 2016

TO-220 FullPAK Wide Creepage package eliminates workarounds

TO-220 FullPAK Wide Creepage package eliminates workarounds
Infineon Technologies has introduced the TO-220 FullPAK Wide Creepage package, offered for the 600V CoolMOS CE MOSFETs which target a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.
27th April 2016

Infineon sensor chips help CERN to detect dark matter

Infineon sensor chips help CERN to detect dark matter
95% of the universe is still considered unexplored. Scientists at CERN, the world’s largest particle physics research centre, are working on solving these mysteries. In May 2012, researchers there discovered the so-called Higgs Boson, whose prediction won Peter Higgs and François Englert the Nobel prize in physics.
26th April 2016


Packaging improves thermal performance

Packaging improves thermal performance
The SOT-223 package allows for a 10% cost reduction, in comparison to DPAK, writes Rene Mente, Infineon Technologies. The SOT-223 is a direct pin-to-pin replacement for DPAK designs with slightly reduced thermal behaviour in comparison to DPAK.
8th April 2016

ThinkPad notebooks to be equipped with OPTIGA TPM chips

ThinkPad notebooks to be equipped with OPTIGA TPM chips
Infineon Technologies will be equipping the lastest Lenovo ThinkPad ntoebooks with OPTIGA TPM (Trusted Platform Module) chips. The PC manufacturer thus responds to an increase of networking and associated security risks. In recent years, Lenovo has sold more than 100m notebooks from the successful ThinkPad family.
5th April 2016

Reducing power and simplifying design

Reducing power and simplifying design
A new integrated power stage family from Infineon Technologies features a power efficiency rating reaching 96%. This means the power stage devices can be combined with Infineon’s generation digital PWM power management controllers. This provides a full multi-phase voltage regulation (VR) system solution for server, storage client and communications systems.
23rd March 2016

Digital PoL regulators enable FPGA development platform

Digital PoL regulators enable FPGA development platform
Infineon Technologies has announced that its digital PoL DC/DC regulators with full PMBus capabilities are featured in the Kintex UltraScale development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the company's IR3806x family. Configurations can be stored in internal memory and PMBus commands allow run-time control, fault status and telemetry.
21st March 2016

SOT-223 package saves space in low power dissipation design

SOT-223 package saves space in low power dissipation design
Designed as a drop-in replacement for its DPAK package, Infineon offers its CoolMOS CE, high voltage MOSFET in a SOT-23 package. It is, says the company, a cost-effective alternative and offers space savings in some designs with low power dissipation. The SOT-223 package, without middle pin, is compatible with a typical DPAK footprint and can be used as a drop-in replacement and targets designs in LED lighting and mobile charger applications.
14th March 2016

How to save the equivalent of Sweden’s annual power consumption

World Energy Efficiency Day, 5th March, aims to increase public awareness of the misuse of energy and give it the importance it merits. A host of useful ideas for saving energy are circulated for the day each year from simply switching off the light to new efficiency innovations. Infineon Technologies shows how a new technology turns household power guzzlers into true efficiency wonders.
4th March 2016

MCUs provide cost-sensitive power control

MCUs provide cost-sensitive power control
The XMC1400 MCUs will open up applications for Infineon Technologies in industrial automation, digital power conversion and electronic control. In comparison with the earlier XMC1000 products, the XMC1400 series offers greater control performance and additional connectivity.
24th February 2016

Welcome to the smartphone of tomorrow!

Unlike conventional mobile phones, smartphones are no longer primarily communication devices, but also tools for entertainment and work. Users run more and more applications in parallel, their smartphones constantly need to boost their performance. At Mobile World Congress in Barcelona, Infineon Technologies will present new solutions that make smartphones more powerful and more energy-efficient.
17th February 2016

EtherCAT implementation made easy with MCUs

EtherCAT implementation made easy with MCUs
EtherCAT implementation complexity and cost can be reduced with the XMC4300 microcontroller series of Infineon Technologies. Without compromise to EtherCAT communication features, the XMC4300 has been specifically developed for cost-sensitive industrial applications that also make high demands on design flexibility, connectivity and real-time performance.
12th February 2016

A digital interface for easy & fast configuration

A digital interface for easy & fast configuration
Easy-to-use, fully integrated and highly efficient DC/DC regulators with I²C/PMBus interfaces, the PMBus SupIRBuck voltage regulator family has been unveiled by Infineon Technologies. The integrated PWM controller, MOSFETs and Bootstrap diode make them space-efficient solutions, providing accurate power delivery for low output voltage and high current applications.
26th January 2016

Infineon strengthens footprint in expanding Chinese payment market

Chip-based payment solutions are easy to use and offer higher data security than magnetic stripe cards. In 2015, China took the pole position worldwide in terms of growth for both issuing volume and the transaction value with chip-based payment cards. As one of the first foreign chip suppliers, Infineon Technologies has received the “China UnionPay Security Product Certification” for its SLE77 security payment chip.
25th January 2016

Infineon security chips protect Microsoft Surface devices

Infineon security chips protect Microsoft Surface devices
Emphasising hardware based security to protect sensitive user data stored on connected devices, Microsoft has integrated OPTIGA TPMs (Trusted Platform Modules) from Infineon Technologies into its latest personal computing devices (including the new Surface Pro 4 tablet and the Surface Book, the first Microsoft branded laptop).
13th January 2016

Driver IC family suits mid- & low-voltage motor drives

Driver IC family suits mid- & low-voltage motor drives
Infineon Technologies expands its 200V driver IC portfolio with the IRS2005 (S, M) for high voltage, high speed IGBTs and power MOSFETs. The driver IC features comprehensive protection for motor drive applications with stringent space constraints such as electric garden equipment, golf carts, power tools and mobility scooters.
7th January 2016

Power supply to become more efficient, more stable & more secure

Power supply to become more efficient, more stable & more secure
Highly developed societies require a stable power supply that also protects the environment. The goal then is to generate electricity in as targeted and sustainable a way as possible and to transmit it and use it as efficiently as possible. The research project "E2SG" (Energy to Smart Grid) supports these goals.
4th January 2016

Explore innovations improving every day life

Microelectronics is the key to a better future and has become an indispensable part of our lives – today and even more tomorrow. At the upcoming CES 2016, Infineon Technologies will highlight chip technologies and system solutions for use across multiple categories of the consumer electronics industry.
21st December 2015

3D image sensor chips bring virtual reality to the smartphone

In the future, mobile devices will be able to quickly and realistically detect their surroundings in 3D. When they do, it will be thanks to the 3D image sensor chips from Infineon Technologies and pmdtechnologies. REAL3 will enable extremely realistic virtual and augmented reality game experiences that involve the interaction of the gamer’s own hands and his living environment within the game via head-mounted devices.
17th December 2015

Single channel low-side drivers integrate robust protection features

Single channel low-side drivers integrate robust protection features
Infineon Technologies expands its µHVIC family of integrated circuits for high and low voltage: the single channel low-side drivers IR44252L, IR44272L and IR44273L enable robust and cost effective design solutions. The device family utilises Infineon’s proven, robust high voltage junction isolation (HVJI) technology to realise multiple functions and integrate robust protection features.
11th December 2015


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