Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com


Infineon Technologies AG articles

Displaying 1 - 102 of 102

CoM simplifies manufacture of dual interface cards

CoM simplifies manufacture of dual interface cards
  Designed for official documents, the Dual Interface CoM (Coil on Module) package technology has been released by Infineon Technologies. The manufacture of Dual Interface electronic identification cards, electronic drivers’ licenses or health insurance cards is simplified by the technology.
30th October 2014

Add value to your application designs

Add value to your application designs
At the Infineon stand (A5.506), visitors can expect to see a raft of live demos, exhibits and 'product to system' innovations which add value to application designs. Company CEO, Dr. Reinhard Ploss, will discuss the IoT at the CEO round table and other speakers from the company have slots at the Embedded Platform Conference, Automotive Conference and Embedded Forum.
17th October 2014

Infineon acquires International Rectifier for $3bn

Infineon acquires International Rectifier for $3bn
Infineon has acquired International Rectifier for $3bn. The acquisition creates a behemoth in power management technology. Infineon expands its product portfolio, gets access to International Rectifier’s acclaimed Gallium Nitride on Silicon (GaN) process for power semiconductors, gains a higher profile in the US as well as a larger regional footprint particularly in Asia/Pacific.
21st August 2014


Circuit breaker for DC power grids investigated

Circuit breaker for DC power grids investigated
There are many advantages to using direct current rather than the alternating current used today. For example, when using direct current there are 5-7% less losses in power grids and electric devices. Direct current also makes it possible to more efficiently feed electric energy from regenerative sources into power grids and energy storage and therefore it improves grid stability.  
1st July 2014

Infineon Technologies to Create Pilot Space for Industry 4.0

Infineon Technologies AG is expanding its Austrian site in Villach. Core emphasis is the on the expansion of expertise for the manufacturing of the future as well as research and development (R&D). “Pilot Space Industry 4.0” will realize and put to the test an innovative concept for networked and knowledge-intensive production.
27th June 2014

Infineon Extends Life Time of IHM-B Modules: High Power Semiconductors Now Last Up to 11 Times Longer

In the future it will be possible to use IGBT High Power Modules (IHM) from Infineon Technologies AG even longer. More robust construction and greatly improved thermal conductivity behaviour increase the average life time in comparison to previous models by a factor of up to 11 under the same conditions of use. A major advantage here is that the electrical and mechanical parameters of the module remain the same in spite of the necessary changes involved. As a result there is no need for recertification and the qualification scope is minimized to an extreme extent.
19th June 2014

Device enables high efficiency in server & datacom systems

Device enables high efficiency in server & datacom systems
Combining two power MOSFETs and a DC/DC driver IC with integrated current and temperature sensing, the DrBlade 2 power stage device has been introduced by Infineon. The low-profile package of the device, which uses galvanic and lamination processes to reduce footprint and height, aids engineers of server and datacom applications in handling high power density requirements and in shortening design-in cycles. 
17th June 2014

Gate driver for demanding industrial applications

Gate driver for demanding industrial applications
Developed for high-end systems in the industrial sector, Infineon Technologies has introduced the 1EDS-SRC EiceDRIVER Safe driver. The component features the first Slew Rate Control (“SRC”) adjustable in real-time at the IGBT and the secure electric isolation of complies with the strict specifications of VDE 0884-10 and has specially developed short-circuit protection functions.
28th May 2014

Leadless surface mounted package for CoolMOS MOSFETs

Leadless surface mounted package for CoolMOS MOSFETs
Infineon Technologies announces a new leadless surface mounted (SMD) package for CoolMOS MOSFETs, designated ThinPAK 5x6. With its height of only 1mm and with its very small footprint of 5x6mm, the ThinPAK 5x6 provides 80% volume reduction in comparison to traditional SMD packages such as DPAK.
19th May 2014

Reverse conducting IGBTs for resonant applications

Reverse conducting IGBTs for resonant applications
Extending the latest generation of reverse conducting IGBTs for resonant applications, Infineon Technologies has announced the 650V RC-H5 family including a monolithically integrated RC diode. These high performance devices are suitable for applications such as multi-hob induction stoves and inverterised microwave ovens, as well as for all partial hard-switching half-bridge topologies.
15th May 2014

Research to strengthen European power electronics industry

Research to strengthen European power electronics industry
The three-year “eRamp” project, led by Infineon Technologies, has been launched to strengthen and expand Germany and Europe as centres of expertise for the manufacture of power electronics. Focused on energy efficiency, 26 research partners from six countries are participating in the €55m project.
4th April 2014

Hardware-based solution secures connected electronics

Hardware-based solution secures connected electronics
Improving the security of electronic devices in connected systems, OPTIGA Trust P is a programmable hardware-based solution from Infineon Technologies. This provides robust device authentication, protects computing systems from both intentional attacks and accidental damage from user error, and enhances security and privacy of stored data.
1st April 2014

Research reduces components required for induction stoves

Research reduces components required for induction stoves
The "InduKOCH" research project has been completed by E.G.O. Group, the University of Bremen's Institute for Electrical Drives, Power Electronics and Devices (IALB), and Infineon Technologies, who headed the project. The three-year research project has reduced the number of components that induction stoves require, making them more affordable and more energy efficient.
24th March 2014

MOSFETs are optimised for body diode hard commutation

Complementing the exisiting Medium Voltage portfolio, the OptiMOS FD 200V and 250V has been launched by Infineon. The latest generation of Power MOSFETs is optimized for body diode hard commutation and leads to higher device ruggedness, lower voltage overshoot and reduced reverse recovery loss.
12th March 2014

MCUs provide 32-bit performance at 8-bit prices

MCUs provide 32-bit performance at 8-bit prices
At embedded world 2014, Infineon has announced volume production of its XMC1000 microcontrollers that offer 32-bit performance at 8-bit prices. Utilising the ARM Cortex-M0 processor, the MCUs are consistently optimised in line with their target applications: sensor and actuator applications, LED lighting, simple motor drives and digital power conversion.
28th February 2014

IGBT is optimised for induction cooking applications

IGBT is optimised for induction cooking applications
Focusing on system efficiency and demanding reliability requirements for induction cooking applications, the 20A RC-H5 IGBTs have been announced by Infineon Technologies. The 1350V Reverse Conducting (RC) soft switching IGBT provides up to 30% reduction in switching losses compared to previous generations.
25th February 2014

TVS diodes protect high-speed data interfaces

TVS diodes protect high-speed data interfaces
Enabling mobile devices that are lighter, faster and more robust, the ESD105 series of Transient Voltage Suppression (TVS) diodes have been announced by Infineon. Supplied in miniaturised integrated packages, the TVS diodes protect high speed interfaces of electronic systems from Electrostatic Discharge (ESD) strikes.
19th February 2014

ORIGA 3 Improves User Experience by Enabling Accurate Fuel Gauging in Mobile Devices

Infineon Technologies’ new ORIGA 3 Battery Management IC protects smartphone and tablet computer users from unpleasant surprises. Its proprietary PrediGauge technology allows for highly accurate fuel gauging thus minimizing the risk of unexpectedly running out of power. 
12th February 2014

Dual-Hall sensor detects rotation direction & speed

Dual-Hall sensor detects rotation direction & speed
Claiming to be the first dual-Hall device with integrated Hall plates oriented vertically and not horizontally on the chip surface, the TLE4966V from Infineon detects rotation direction and speed. With the Hall plates orientatated vertically and at 90°, the sensor is sensitive to magnetic fields with in-plane direction and provides flexibility to fit designs into space-constrained areas.
18th December 2013

Infineon lands leading supplier title for 10th time in a row

For the tenth time in a row, Infineon Technologies has been named the world's leading supplier of power semiconductors by a report from market research institute IHS Inc. Coming in at number two in the report was Toshiba with a market share of 7.1%, compared with Infineon's 11.8% market share. During the 2012 study period, the market volume for power semiconductors dropped by nearly 16 percent to US Dollar 15 billion.
2nd December 2013


Network Headlines

The source for EOL devices

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

 

WEBENCH® Designer