Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com


Infineon Technologies AG articles

Displaying 1 - 111 of 111

Members of Infineon's board standing for re-election

At the Annual General Meeting on 12th February 2015 in Munich, the current members on the capital side of the Supervisory Board of Infineon Technologies will be standing for re-election. The capital side of the Supervisory Board is currently represented by Wolfgang Mayrhuber, Hans-Ulrich Holdenried, Prof. Dr. Renate Köcher, Dr. Manfred Puffer, Prof. Dr. rer. nat. Doris Schmitt-Landsiedel and Dr. Eckart Sünner.
19th December 2014

USB token is Google Security Key compatible

 Allowing users to reduce the complexity of password-based log-on to services, and strengthen protection against unauthorised access, Infineon has released security chips and Fast IDentity Online (FIDO)-Ready authenticator reference designs.
10th December 2014

Platforms address emerging IGBT requirements

Platforms address emerging IGBT requirements
Designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV, two power module platforms have been released by Infineon Technologies. Currently, the power module platforms are suitable for 3.3, 4.5, and 6.5kV IGBTs measuring 100x140x40mm. 
10th December 2014


Arduino shields enable RGB lighting & motor control

Arduino shields enable RGB lighting & motor control
  Compatible with the Arduino Uno R3, two shields have been announced by Infineon Technologies for RGB lighting and motor control applications. Both shields can be combined with the XMC1100 Boot Kit which is equipped with a 32-bit MCU from the XMC1000 family.
8th December 2014

Infineon acquires 9.4% of Schweizer

Infineon Technologies has announced that it will acquire a 9.4% stake in Schweizer Electronic. The relevant contracts were concluded today with both companies agreeing on strict confidentiality regarding the terms.
26th November 2014

Power modules provide a low transient thermal resistance

Power modules provide a low transient thermal resistance
To address the specific requirements of cost-effective applications, Infineon Technologies has released bipolar power modules in solder bond technology. The PowerBlock modules expand the company’s power module portfolio which, thus far, was only using pressure contacts. Infineon offers optimised solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by cost and/or performance restrictions.
25th November 2014

IGBT enables more compact product designs

IGBT enables more compact product designs
  The TO-247PLUS package has been introduced by Infineon Technologies, expanding its discrete IGBT portfolio for high power applications. The package, which has the same footprint and pin-out as JEDEC standard TO-247-3, enables up to 120A IGBT co-packed with a full rated diode.
24th November 2014

Integrated bridge drivers enable smart motor control

Integrated bridge drivers enable smart motor control
To address the growing trend towards intelligent motor control, Infineon Technologies has introduced the ARM-based Embedded Power family of bridge drivers at electronica 2014. Claimed to be an industry first, the drivers feature a high-performance MCU powered by the ARM Cortex-M3 processor, NVM, analogue and mixed signal peripherals, communication interfaces and MOSFET gate drivers.
12th November 2014

IGBT package improves power density & reduces system costs

IGBT package improves power density & reduces system costs
Addressing the need for increased power density and space saving in applications requiring high efficiency, Infineon Technologies has released a variant of the TO-247 package. The TO-247 4 Kelvin-Sense package provides efficiency levels previously unavailable when used together with the company’s TRENCHSTOP 5 IGBT and Rapid diode technologies. 
4th November 2014

CoM simplifies manufacture of dual interface cards

CoM simplifies manufacture of dual interface cards
  Designed for official documents, the Dual Interface CoM (Coil on Module) package technology has been released by Infineon Technologies. The manufacture of Dual Interface electronic identification cards, electronic drivers’ licenses or health insurance cards is simplified by the technology.
30th October 2014

Add value to your application designs

Add value to your application designs
At the Infineon stand (A5.506), visitors can expect to see a raft of live demos, exhibits and 'product to system' innovations which add value to application designs. Company CEO, Dr. Reinhard Ploss, will discuss the IoT at the CEO round table and other speakers from the company have slots at the Embedded Platform Conference, Automotive Conference and Embedded Forum.
17th October 2014

Infineon acquires International Rectifier for $3bn

Infineon acquires International Rectifier for $3bn
Infineon has acquired International Rectifier for $3bn. The acquisition creates a behemoth in power management technology. Infineon expands its product portfolio, gets access to International Rectifier’s acclaimed Gallium Nitride on Silicon (GaN) process for power semiconductors, gains a higher profile in the US as well as a larger regional footprint particularly in Asia/Pacific.
21st August 2014

Circuit breaker for DC power grids investigated

Circuit breaker for DC power grids investigated
There are many advantages to using direct current rather than the alternating current used today. For example, when using direct current there are 5-7% less losses in power grids and electric devices. Direct current also makes it possible to more efficiently feed electric energy from regenerative sources into power grids and energy storage and therefore it improves grid stability.  
1st July 2014

Infineon Technologies to Create Pilot Space for Industry 4.0

Infineon Technologies AG is expanding its Austrian site in Villach. Core emphasis is the on the expansion of expertise for the manufacturing of the future as well as research and development (R&D). “Pilot Space Industry 4.0” will realize and put to the test an innovative concept for networked and knowledge-intensive production.
27th June 2014

Infineon Extends Life Time of IHM-B Modules: High Power Semiconductors Now Last Up to 11 Times Longer

In the future it will be possible to use IGBT High Power Modules (IHM) from Infineon Technologies AG even longer. More robust construction and greatly improved thermal conductivity behaviour increase the average life time in comparison to previous models by a factor of up to 11 under the same conditions of use. A major advantage here is that the electrical and mechanical parameters of the module remain the same in spite of the necessary changes involved. As a result there is no need for recertification and the qualification scope is minimized to an extreme extent.
19th June 2014

Device enables high efficiency in server & datacom systems

Device enables high efficiency in server & datacom systems
Combining two power MOSFETs and a DC/DC driver IC with integrated current and temperature sensing, the DrBlade 2 power stage device has been introduced by Infineon. The low-profile package of the device, which uses galvanic and lamination processes to reduce footprint and height, aids engineers of server and datacom applications in handling high power density requirements and in shortening design-in cycles. 
17th June 2014

Gate driver for demanding industrial applications

Gate driver for demanding industrial applications
Developed for high-end systems in the industrial sector, Infineon Technologies has introduced the 1EDS-SRC EiceDRIVER Safe driver. The component features the first Slew Rate Control (“SRC”) adjustable in real-time at the IGBT and the secure electric isolation of complies with the strict specifications of VDE 0884-10 and has specially developed short-circuit protection functions.
28th May 2014

Leadless surface mounted package for CoolMOS MOSFETs

Leadless surface mounted package for CoolMOS MOSFETs
Infineon Technologies announces a new leadless surface mounted (SMD) package for CoolMOS MOSFETs, designated ThinPAK 5x6. With its height of only 1mm and with its very small footprint of 5x6mm, the ThinPAK 5x6 provides 80% volume reduction in comparison to traditional SMD packages such as DPAK.
19th May 2014

Reverse conducting IGBTs for resonant applications

Reverse conducting IGBTs for resonant applications
Extending the latest generation of reverse conducting IGBTs for resonant applications, Infineon Technologies has announced the 650V RC-H5 family including a monolithically integrated RC diode. These high performance devices are suitable for applications such as multi-hob induction stoves and inverterised microwave ovens, as well as for all partial hard-switching half-bridge topologies.
15th May 2014

Research to strengthen European power electronics industry

Research to strengthen European power electronics industry
The three-year “eRamp” project, led by Infineon Technologies, has been launched to strengthen and expand Germany and Europe as centres of expertise for the manufacture of power electronics. Focused on energy efficiency, 26 research partners from six countries are participating in the €55m project.
4th April 2014


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