Subrack chassis and modules are MicroTCA.1 compliant
VadaTech has announced MicroTCA.1 compliant chassis and modules for air-cooled rugged applications. Utilising an enhanced retention screw to hold the modules in place for rugged environments, the MicroTCA.1 specification defines a maximum operating shock of 25g and random vibration of 8g.
The first in this product line is the VT930, a 3U subrack featuring up to 12 AMC slots, including up to six full-size (6HP) and six mid-size (4HP) modules. Cooled from an external fan tray below the card cage with perforated top and bottom covers, the VT930 subrack has a 40GbE capable passive backplane with dual MicroTCA Carrier Hub slots and dual Power Module slots.
VadaTech also offers modules in the MicroTCA.1 format. Most of VadaTech’s 250+ Advanced Mezzanine Card (AMC) modules for MicroTCA can be easily modified by the company to meet the rugged specification (which requires a latching screw for retention and stability). The company also supplies hardened chassis and modules in the conduction cooled MicroTCA.3 format.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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