ADC/DAC/GPIO combine to provide monitoring & control

The combination of on-chip features allows system designers to reduce BOM costs and increase design portability and reuse with only minor software changes.

The single-chip AD5592R saves up to 85% required by discrete implementations by using a small 2x2mm WLCSP package. The small package suits the device for high-density and space-constrained applications such as wired and wireless communications, building control or any general monitoring or control application where size and design flexibility are key requirements. The device not only simplifies system architectures but enables greater system functionality because of the ability to add extra control and monitoring capabilities within a single part.

A safe power-up functionality prevents conflict with external circuitry if set up incorrectly, and a digital temperature indicator/alert signals fault condition and allows system shutdown. A 2.5V, 25ppm/°C internal reference combines with a -40 to +105° operating temperature range.