Design
Collaboration results in 14nm tri-gate design platform
A broad SoC design enablement for Intel's 14nm Tri-Gate process technology, for use by customers of Intel Custom Foundry, has been announced in a joint statement by Synopsys and Intel. The Intel Custom Foundry 14nm design platform supports Synopsys' industry-leading Galaxy Design Platform tools and RTL to GDSII methodology, high performance DesignWare Memory Compiler IP, and advanced interface IP.
3D PCB design tool update facilitates design reuse
An update to Altium Designer, a 3D PCB design tool, offers improved support and features that facilitate design reuse and more efficient electronics design. The update to Altium's signature PCB design software was made in response to user community feedback and is available to all subscription users.
Software integration unites full-wave EM field simulation standard
AWR and ANYS have announced the successful integration of ANSYS HFSS into AWR's Microwave Office high frequency circuit design software. This integration unites the industry standard for full-wave EM field simulation and NI AWR Design Environment/Microwave Office to quickly and accurately simulate microwave circuits.
3D design tool workshops target academia
RS Components has decided one route to the student market is to educate their lecturers. The high service distributor plans to run a series of one-day workshops on its 3D design tool DesignSpark Mechanical at universities across Europe. The free workshops are designed for university-based academics and educators of electronics, industrial engineering or mechatronics, enabling them to return to their respective institutions with this newly gained ...
Broadcom 5G WiFi combo chip selected for 4K smart TV
Broadcom has revealed that Xiaomi has selected the company's 2X2 MIMO 5G WiFi combo chip for the smart 4K Mi TV2. Broadcom's BCM43569 5G WiFi (802.11ac) solution with integrated beamforming technology enables manufacturers of home entertainment platforms to deliver the speed, range and bandwidth required for streaming HD content, interactive online gaming and seamless connectivity with mobile devices.
Development tools for Freescale automotive processors
Green Hills Software has announced what the company claims is the industry’s first combined support for the latest automotive processor families from Freescale Semiconductor: the Qorivva MPC5xxx targeting engine and body applications; and the MAC57Dxx family targeting digital instrument clusters.
DAC demo for HEVC/H.265 IP core
Design Automation Conference debutant Allegro DVT plans to perform a live demonstration of its HEVC/H.265 encoder IP core. The demonstration will be conducted on a prototyping platform. High Efficiency Video Coding (HEVC), alias H.265, is the next generation video standard. It brings 50% bitrate savings compared to equivalent H.264/AVC encodings.
Certification enables increased transceiver use in smart metering
The SX1272 development kit, from Semtech, has received Wi-SUN Alliance certification. The certification paves the way for increased use of the Semtech LoRa-based SX1272 transceiver in energy management and smart metering applications. The Wi-SUN Alliance is an association of companies working together to enable reliable, cost-effective, low-power wireless utility products based on the open global standard, IEEE 802....
Complete PCI Express 4.0 IP solution targets enterprise computing
A complete PCI Express 4.0 IP solution, which Synopsys claims as an industry first, is now available to designers. Consisting of DesignWare PHY, controllers and verification IP, the solution targets enterprise computing applications such as servers, networking, storage systems and SSDs. The PCI Express 4.0 specification doubles throughput to 16 GT/s and is currently at a preliminary revision 0.3 within the PCI Special Interest...
Software enables quick MAX 10 FPGA design
Enabling designers to start their MAX 10 FPGA designs immediately, Altera have announced the availability of Quartus II beta software and early access documentation for MAX 10 FPGAs. Based on TSMC’s 55nm embedded flash process technology, MAX 10 FPGAs revolutionize non-volatile FPGA integration by delivering advanced processing capabilities into a small form factor, low-cost, instant-on programmable logic device.