Communications
SBC operates at 5-10W thermal design power
A 4” SBC, which features low-power consumption at only 5-10W thermal design power, has been introduced by DFI. The BT253, which expands the company’s Intel Atom E3800 SoC product portfolio, features BGA 1170 packaging technology. LVDS, HDMI, VGA (standard) and DVI-I (optional) interfaces, with dual-independent display capability, enhance onboard graphics capabilities.
EV car charger solution features V2G communication
Microsemi and STMicroelectronics have contributed to the development of an EV car charger solution targeted at IoT system designers. Featuring V2G (Vehicle-to-Grid) communication and support for a wide range of network and application protocols,Tatung's module for EV supply equipment utilises Microsemi’s Le87501 PLC line driver and ST’s ST2100 STreamPlug SoC. The solution, which is supported by the OpenV2G software stack, also ut...
WiFi module enables photo & video capture nano platform
To provide secure, onboard WiFi technology for its ZANO nano drone, an aerial photography and HD video capture nano platform which allows users to capture and share photographs and video content instantly, Torquing Group has tapped Lantronix.
Cypher suites offer confidentiality, integrity & secrecy
Phaedrus Systems is launching emSSL, a ground-up implementation of secure sockets that are the backbone of secure communications on the internet today. Written by Segger Microcontroller to run effortlessly on single-chip embedded devices, emSSL integrates seamlessly with Segger's embOS/IP or, alternatively, any IP stack that supports plain sockets, or any bidirectional communications channel.
DSP IP core for SoC 32-bit audio/voice processing
The Cadence Tensilica HiFi 4 audio/voice DSP IP core for SoC designs offers what Cadence hails as ‘the industry’s highest performance licensable DSP core for 32-bit audio/voice processing’. This 4th gen HiFi architecture enables emerging multi-channel object-based audio standards and doubles the performance of the HiFi 3 DSP, making it suitable for DSP intensive applications including digital TV, set-top box, Blu-ray Disc and au...
AC2000 router offers 4x4 802.11ac for 5GHz WiFi
A solution designed for the Ethernet retail router market has been introduced by Lantiq and Quantenna Communications. Combining Quantenna’s QSR1000 4x4 802.11ac with Lantiq’s GRX300 communications processor family, the AC2000 solution provides high performance WiFi technology to the mid-range Ethernet retail router market.
Investment aims to drive global V2X uptake
V2X technology will allow cars to communicate with one another and the surrounding intelligent traffic infrastructure by wirelessly exchanging real-time warning messages and traffic information. Aiming to drive the rapid global uptake of V2X technology, NXP Semiconductors has announced a follow-on investment in Cohda Wireless, a software company specialising in automotive safety applications.
MIMO chip is the basis for HPAV2 nexwork extension kit
The technology behind D-Link's PowerLine AV2 2000 Gigabit Starter Kit for home networks is the BCM60500 HomePlug AV2 (HPAV2) MIMO chip, maker Broadcom has announced. Broadcom's powerline technology at chip level allows D-Link to deliver a significant increase in throughput and coverage performance for a variety of home connectivity devices.
SSL/TLS solution targets embedded devices
SEGGER has introduced emSSL, a ground-up implementation of secure sockets that are the backbone of secure communications on the Internet today. Written to run effortlessly on single-chip embedded devices, emSSL integrates seamlessly with embOS/IP or, alternatively, any IP stack that supports plain sockets, or any bidirectional communications channel.
V2V technology successfully tested by Audi
Audi has concluded an extensive field test of V2V communications technology developed by NXP Semiconductors and Cohda Wireless. During the test, V2V-enabled Audi vehicles equipped with the NXP RoadLINK chipset drove towards one another at relative speeds of up to 500km/h, communicating across distances of more than 2km.