Free seminars will be on offer at Samtec’s stand during the electronica exhibition in Munich (Nov 11-14).  The seminars focus on high speed interconnect design considerations, and will be presented by Scott McMorrow, President and SI Consultant of Teraspeed Consulting. They are 20 minutes in duration. Reservations are not required, and time will be available afterwards for questions and discussion.

Samtec’s new SMP jack and plug interfaces are a cost-effective solution for high frequency performance with limited space. These interfaces are ideal for testing applications where a tight, secure connection and high cycles are required, as well as for rugged, high vibration environments such as military, aerospace and mobile technology.

Samtec’s robust PowerStrip/35 Discrete Wire Cable Assembly offers rugged features and is ideal for high performance applications. When mated with Samtec’s PowerStrip/35 high power terminal (PET Series), the system has a current carrying capacity of 28.9A per contact at an ambient temperature of 75º C (with 2 gold plated pins energized and 10 AWG cable).