OFC 2019 in San Diego (March 5-7) is providing the platform for II-VI Incorporated and Samtec to unveil a 56 Gbps PAM4 per channel demonstration of the next-generation Samtec FireFly on-board optical engine technology. II-VI’s recently announced high speed vertical-cavity surface-emitting lasers (VCSELs) are embedded within the FireFly system architecture.

Samtec is releasing new digital models for over 100,000 of its products on SnapEDA circuit board design library. Traditionally, designers have spent days creating digital models - such as symbols and footprints - for each component in their designs. Connectors are especially time-consuming to create models for, due to their non-standard shapes, pitches, pads, and cutouts.

  Samtec supports the release of the new ANSI/VITA 57.4-2018 FPGA Mezzanine Card Plus Standard. VITA 57.4, also referred to as FMC+, expands upon the I/O capabilities defined in ANSI/VITA 57.1 FMC by adding two new connectors that enable higher data rates.

Samtec has announced the Flyover QSFP28 Cable System. This new system can support 28G NRZ/56G PAM 4 data rates per channel, and it provides system design flexibility. Samtec’s Flyover QSFP28 Cable System allows sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew. This system can provide aggregate data rates of 100Gbps NRZ/200 Gbps PAM4, and is compatible with all MSA QSFP pluggables.

Manufacturer of a broad line of electronic interconnect solutions, Samtec, proudly announces the release of the two new FireFly FMC+ Development Kits. The first supports data rates of 25Gbps per channel while the second runs at 28Gbps per channel. These new solutions offer easy-to-use evaluation and development platforms for Samtec’s FireFly optical engines.

As an ANSI/VITA member, Samtec, a privately held manufacturer of a broad line of electronic interconnect solutions, is proud to release new connector sets compliant with the revised ANSI/VITA 42.0-2016 XMC Standard. 

  Samtec has announced the release of the industry’s first 0.50mm pitch edge card socket (MEC5) with justification beam. This design meets the demands for decreased size and increased speeds, while also optimising cost.

  Samtec has released a higher density signal count and new AC power option available with the EXTreme Ten60Power system. TSamtec's EXTreme Ten60Power header and socket system (ET60T/ET60S Series) is available in both power/signal combinations and power only for increased design flexibility.

Samtec has expanded its line of edge card connectors with 0.80 and 1.00mm pitch sockets designed for higher speed applications and optimal mating alignment. The 0.80mm pitch socket (HSEC8-DP series) is a differential pair version of Samtec’s popular Edge Rate 0.80mm pitch sockets. Rated for speeds to 28Gbps NRZ/56Gbps PAM4, the socket features Edge Rate contacts designed to increase cycle life and decrease crosstalk.

  Global manufacturer of a broad line of electronic interconnect solutions, Samtec, has announced the release of two new VITA 57.4-compliant FMC+ Loopback Cards. These new solutions provide FPGA designers easy to use loopback options for testing low-speed and high-speed multi-gigabit transceivers on any FPGA development board or FPGA carrier card.

Samtec has announced the release of the new 14 Gbps FireFly FMC Development Kit. This new solution offers an easy-to-use evaluation and development platform for Samtec’s FireFly optical engines. The 14 Gbps FireFly FMC Module provides up to 140 Gbps full-duplex bandwidth over 10 channels from an FPGA to an industry-standard multi-mode fiber optic cable.

Samtec has announced the Consortium for On Board Optics (COBO) has adopted a two-piece surface mount connector system based on Samtec’s FireFly Micro Flyover System for the next generation of standardized on-board optical modules. As part of the new miniature footprint, the Power/Control connector from Samtec reduces the size of on-board optical modules while increasing port density in data center and HPC applications.

Samtec has announced the expansion of its line of standard and custom AccliMate sealed cable plugs and receptacles, including new crimp sealed bayonet latching circulars. These systems meet IP67/IP68 requirements for dustproof and waterproof sealing and are designed for industrial, outdoor, underwater and other harsh environments.

Samtec announces the release of the first Samtec nMode Wireless Sensor Module. The production-ready solution allows engineers to remotely sense and measure inertial, environmental and acoustical parameters. Samtec’s 13.5mm x 13.5mm nMode Wireless Sensor Module contains a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone —all from STMicroelectronics, a global semiconductor leader serving cust...

Samtec is participating in next year’s DesignCon 2017 conference and exhibition at the Santa Clara Convention Centre 31st January to 2nd February. Samtec’s Director of Signal Integrity Jim Nadolny will be presenting a 45 minute technical paper session covering ‘Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.’

Samtec has released a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s FMC+ connectors help support the expanded interface and faster speeds of FMC+ applications.

An extended temperature version of Samtec's FireFly Active Optical Micro Flyover Cable Assembly has been released. The ETUO series supports temperature ranges of -40 to 85°C. The ETUO series shares the core features of Samtec’s existing ECUO series FireFly Active Optical Micro Flyover Cable Assembly. 

The technical collaboration between Samtec and PLDA provides a groundbreaking solution for PCIe 4.0 endpoint development by combining PLDA’s PCIe 4.0 hardware and IP with the Samtec’s PCUO PCIe Optical Flyover Cable Assembly. The PLDA PCIe 4.0 Platform Development Kit (PDK) is a complete development platform based on PLDA’s PCIe compliant XpressSWITCH IP and PLDA’s XpressRICH4 controller IP for PCIe Gen...

Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, announces the expansion of the ExaMAX High-Speed Backplane Connector System optimised for high-density and high-speed performance. The scalable ExaMAX system meets today’s data rates while providing a future-proof path for next generation architectures.

Samtec has announced its entrance in the Silicon Photonics Program of the IRT Nanoelec, headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialise optical communications solutions using silicon photonics technology for addressing data centres and high-performance computing applications.