Companies

Nexperia

Nexperia Articles

Displaying 101 - 120 of 123
Power
1st April 2019
Automotive LED drivers deliver 250mA output current

Nexperia has extended its constant current LED driver family with eight new AEC-Q101 qualified devices to drive low- and medium-power LEDs up to 250mA. The 16V NCR32xx and 40V NCR42xx series are available in two package styles, the space-saving SOT457 (SC-74) and the SOT223 (SC-73), a slightly-larger option which delivers a higher power capability of up to 1,250mW.

Power
25th March 2019
Lowest RDS(on) MOSFETs without compromising vital parameters

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that its lowest-ever RDS(on) NextPower S3 MOSFETs in Trench 11 technology has been achieved without compromising other important parameters such as drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG.

Power
6th March 2019
Automotive logic parts 64% smaller than leaded equivalents

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions claim to be the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.

Power
14th February 2019
Automotive MOSFETs for demanding powertrain applications

Global specialist in discretes, logic and MOSFET devices, Nexperia, has introduced a portfolio of low RDS(on) 40V AEC-Q101 MOSFETs targeting space-constricted, increased-power modules in demanding powertrain applications. Housed in the miniature, LFPAK33 package which has a footprint of only 10.9mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology.

Power
13th September 2018
MOSFETs in miniature packages enable automated inspection

Nexperia has announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175°C and are available in the AOI-compatible DFN2020 package. More, the devices measure just 2mm x 2mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.

Power
28th August 2018
Logic package reduces assembly costs and increases reliability

  Nexperia has announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost effective.

Passives
5th July 2018
ESD protection series deliver high surge robustness

Nexperia has announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the s...

Power
7th June 2018
Lowest RDS(on) automotive MOSFETs down to 0.9mΩ

Nexperia has announced the release of the company’s lowest RDS(on) automotive-qualified MOSFETs. The AEC-Q101 Trench 9, 40V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices. The 0.9mΩ, 220ADC-rated BUK9J0R9-40H MOSFET suits applications up to 1.2kW, and is al...

Analysis
19th April 2018
Nexperia secures $800m financing to fund future growth plans

Nexperia has announced the completion of a refinancing of its current facilities with $800m equivalent of senior credit facilities. This includes a significant proportion of Revolving Credit facility. The proceeds will be used to refinance existing outstanding debt and for Capex expenditure to fund future growth. The facilities were arranged by Bank of America Merrill Lynch and HSBC, acting as Global Coordinators, and were syndicated by a gr...

Power
12th March 2018
Broad range of space-saving PN and Trench Schottky rectifiers

Nexperia has announced the launch of a wide range of PN and Trench Schottky rectifiers for power applications including automotive, industrial and consumer. In total, the company now offers more than 90 devices in the CFP packages. Nexperia CFP packaging is size- and thermally-efficient. The package design has a solid copper clip and exposed heat sink to reduce the package’s thermal resistance and optimise the transfer of heat into the...

Test & Measurement
7th March 2018
Nexperia opens expansion at Guangdong assembly and test facility

Nexperia formerly opened a significant expansion to its ATGD discrete semiconductor assembly and test plant in Guangdong, China. The total production and warehouse site now covers an area of around 72,000m², adding an extra 16,000m² of production space. This will enable the factory in Guangdong to produce 90 billion parts annually, representing an increase of around 50% depending on product mix, and supporting Nexperia’s ambi...

Power
2nd March 2018
Next-gen devices improve switching efficiency

  Nexperia has announced its NextPower 100V family of power MOSFETs which delivers low reverse recovery charge (Qrr) and includes parts that are qualified to 175°C in the LFPAK56 (PowerSO8) package.

Robotics
2nd March 2018
Nexperia supports engineers of the future with sponsorship

  Nexperia has announced that it will be the main industry sponsor for the University of Twente’s RoboTeam, a multidisciplinary student group that aspires to innovate in both robotics and artificial intelligence.

Power
28th February 2018
Logic dividers deliver space-saving up to 93% for system efficiency

Nexperia has announced a new range of AHC (Advanced High speed CMOS) dividers with oscillators that save space, increase efficiency and reduce overall system cost. This new 74AHC1G42xx dividers range also offers overvoltage-tolerant inputs for mixed voltage mode operation, increasing reliability and flexibility in designs.

Power
19th December 2017
Translator solution addresses standard logic shift register market

  Nexperia has announced that it is expanding its logic portfolio with new devices that expand the company‘s translator solutions into the standard logic shift register arena.

Power
5th October 2017
Robust MOSFETs suitable for automotive applications

  Former Standard Products division of NXP, Nexperia, has announced a new series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company’s low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness.

Power
26th September 2017
Automotive power MOSFETs designed for space efficiency

The former standard products division of NXP, Nexperia has announced a new range of 80V dual Power-SO8 MOSFETs in the popular LFPAK56D package. With the addition of this new 80V range of MOSFETs, Nexperia now offers what it claims to be the industry’s most comprehensive portfolio of devices, ranging from 30-100V. LFPAK56D is fully automotive qualified to AEC-Q101 and has a proven track record for quality and reliability.

Power
5th September 2017
Protection portfolio with three TVS diode families

  Nexperia has announced three miniature TVS diode families that are available in space-saving packages for applications in portable devices, including USB – Power Delivery (USB-PD) protection. All the new parts feature high surge ratings and high peak pulse power.

Robotics
31st July 2017
They think they’re all robots… They are now

It has been announced that the University of Twente’s RoboTeam, a multi-disciplinary student group that aspires to innovate in both robotics and Artificial Intelligence (AI), has received sponsorship from Nexperia, the former Standard Products division of NXP. The team competed in RoboCup 2017, the world championships of robot soccer in Japan which focuses mainly on AI.

Automotive
27th March 2017
Achieving automotive power in a smaller package

At embedded world Nexperia, the former Standard Products division of NXP, announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices. LFPAK33 devices also feature a lower resistance, responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and re...

First Previous Page 6 of 7 Next Last

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier