Intelligent Memory (IM), a manufacturer of industrial-grade memory product solutions, is launching a family of DDR5 memory modules in commercial and industrial temperature ranges as well as in completely lead-free options.

Intelligent Memory (IM) will showcase its new microSD and SD cards with capacities of 512MB, 1GB and 2GB at embedded world 2024 in Nuremberg in hall 1, booth 340 from April 9 to 11.

All too often, NAND flash manufacturers advertise program/erase (P/E) cycles as a true representation of endurance. However, using this metric to estimate the lifetime of NAND flash will always provide an overly optimistic result.

Intelligent Memory, a manufacturer of industrial-grade memory product solutions, and Simms International, a specialized distributor of memory and storage solutions, are joining forces at the EDS 2023 trade show in Coventry, October 11-12.  Visit Simms and IM at stand F9 to check out IM’s comprehensive line-up of DRAM and NAND Flash memory products, which prioritize durability, reliability, and long-lasting availability.

In June 1968 a patent was granted for the idea of a single transistor, single capacitor memory cell idea. That was the birth of DRAM memory. This memory cell structure is so ubiquitous today, that it’s hard to see how radical this new approach was.

I'M Intelligent Memory has doubled its maximum offerings of DDR3 memory-capacity again to 16 Gigabits per component. While most DRAM manufacturers produced DDR3 memory with a maximum of 4Gb per chip, Intelligent Memory followed its motto ‘beyond limits’ having offered DDR3 devices with 8Gb capacity for more than six years.

Four years after bringing the first DRAM with on-chip ECC in DDR1, DDR2 and DDR3 technologies to the market, Intelligent Memory is expanding the product line again adding a new series of LPDDR4(X) memory components with integrated ECC error-correction capability.

Hong Kong based fabless DRAM manufacturer, I'M Intelligent Memory, has announced the availability its newest revisions of 8 Gigabit DDR3L components. Orderable devices include x8 (1Gx8) configurations in FBGA 78 ball package and x16 (512Mx16) types in FBGA 96 ball package. Customers can choose the devices to have either a single Chip-Select (1CS) or dual Chip-Select (2CS) pinout.

Memory manufacturer, Intelligent Memory, has released DRAMs in traditional SDRAM-technology with on-chip ECC functionalities. As IM started off their ECC DRAM series with DDR1, DDR2, DDR3 and LPDDR technologies originally, now coming up with SDRAM-devices sounds like a technological step backward.

  A family of robust ECC DRAM components withstanding even the highest operating temperatures and stress has been released by Intelligent Memory.

8Gb DDR3 components with a single chip-select, claimed to be the world's first, have been introduced by I'M Intelligent Memory. The JEDEC specification JESD79-3 has always allowed an 8Gb density for DDR3 memory devices. While most DRAM manufacturers are waiting for a 2 x nm process to fit such high memory capacity into a single DRAM IC package, I’M has manufactured 8Gb DDR3 components utilising existing 30nm manufacturing technolo...