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| Experience product premieres and top speakers from the field of electronics virtually.
- Four topic-specific conferences
- Free visit of the exhibition incl. forum program
- Networking and knowledge transfer
A must for top management and experts from the industry! |
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| At electronica virtual 2020, Electronic Specifier will be holding a digital forum programme on cyber security as part of the trade fair on 11th and 12th November, from 14:00 to 17:00. These will focus on embedded systems, healthcare, IoT and the automotive industry. |
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| NXP Semiconductors has announced that it is enhancing its machine learning development environment and product portfolio. Through an investment, NXP has established an exclusive, strategic partnership with Au-Zone Technologies to expand NXP’s eIQ Machine Learning (ML) software development environment with easy-to-use ML tools and expand its offering of silicon-optimised inference engines for Edge ML. |
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| Swissbit AG will be presenting robust and durable flash memory solutions for industrial applications at electronica virtual 2020 (November 9-12, 2020). Swissbit’s Embedded IoT Solutions division will showcase hardware-based security solutions designed for the protection of data and devices in IoT applications. The compelling Embedded IoT growth market is also the subject of a Swissbit presentation in the conference program. |
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| Renesas Electronics has announced the extension of its microcontroller (MCU) portfolio designed for motor control applications targeting smart homes, industrial automation, and building automation. Featuring a rich set of peripheral functions and AI-based failure detection, the four new RA6T1 MCU group are the latest members of Renesas’ rapidly expanding Arm-based RA Family, and the first RA MCUs designed for the unique needs of motor control in home appliances, HVAC, solar inverters, and AC drives. |
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| When or if an effective COVID-19 vaccine is discovered, the next major challenge will be to scale up its development, clinical trials and manufacture to unparalleled levels, according to Design Momentum and Plextek. The two companies are working together to develop technology for a new range of lab-based collaborative robots. |
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| Despite our obvious reliance on vehicles, manufacturers must continue to develop and embrace new technologies in order to remain competitive. As we move towards new ownership models, these differentiating factors will have an increasingly important influence on consumer choice. |
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| Silicon Labs has announced a new high-reliability (HiRel) isolation technology partnership with Teledyne e2v HiRel. Under the new agreement, Teledyne will offer a new specialised line of high-reliability products based on Silicon Labs’ isolated gate driver technology optimised for space, aerospace, military and oil and gas markets. |
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| Mentor has announced a partnership with Arm to help integrated circuit (IC) designers optimise and streamline the functional verification of their Arm-based designs. With this collaboration, the Arm Design Reviews program now offers the expertise of Mentor’s top functional verification engineers to help customers optimise their Arm-based System-on-Chip (SoC) designs. |
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| STV Electronic has launched a smart digital I/O expansion module for its Raspberry Pi 3 B+ based DIN rail PC. The new I/O Module 16, which can be operated remotely from the system via RS-485, provides four digital inputs, four digital outputs, and eight flexible interfaces, configurable either as digital input or digital output. The Smart Manager 4.0 can control up to eight of these expansion modules via RS-485, making it possible to provide a total of 16 to 128 flexibly configurable digital I/Os. |
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