Communications
AS-i modules provide easy PLC connections
Connecting Rockwell Logix control systems to an AS-interface network has never been simpler with the introduction of Molex's new Brad SST Actuator Sensor Interface Modules. The AS-i modules provide an open fieldbus solution enabling an easy connection between the PLC backplane and simple field I/O devices such as actuators, sensors, rotary encoders, analogue inputs and outputs, push buttons, and valve position sensors.
Meeting the demands of infotainment
Innovative circuit design is leading to more flexibility in power system design for automotive entertainment systems. By Nathan Hanagami, Design Engineer, Steve Knoth, Senior Product Marketing Engineer, & Marty Merchant, Applications Engineer, all from the Power Products Group of Linear Technology.
SATA eSSDs for use in tiered server storage systems
Available in capacities of 120GB, 240GB and 480GB, the new HK3R eSSDs signal an expansion of Toshiba's range of Enterprise-class SSDs. Designed for use in tiered server storage systems, the new eSSDs are ideal for use in read-intensive applications such as fast boot drives and for cache and error logging.
A blessing or a curse?
Examining the importance of industry standards in wireless communication applications. By Cees Links, CEO & Founder of GreenPeak Technologies.
Seamless in-car connectivity with Android devices
Broadcom is enabling seamless in-car connectivity with Android-powered devices thanks to its new Automotive Bluetooth software stack. Enabling automotive manufacturers to respond to new trends and reach the market more quickly, Broadcom's Android Automotive Bluetooth software ensures seamless, end-to-end interoperability between in-car applications and mobile Android devices.
A guide to DAS optimisation
The optimisation of an in-building distributed antenna system (DAS) can provide flexible network designs which right-size the solution to the requirement, while reducing costs. Moti Shalev, Director of Product Management at Axell Wireless, explores more in this ES Design magazine article.
New TI interface IC supports 3D resolution at 120fps
Texas Instruments is supporting the industry's highest screen resolution up to 4K2Kp60 with the new SN65DSI86 interface IC. Providing an MIPI DSI bridge between the graphics processor and embedded DisplayPort panel, the new interface IC features its dual MIPI DSI channels in a 20% smaller 5 mm x 5mm package. Offering greater design flexibility for space-constrained mobile applications, this makes the SN65DSI86 ideal for tablets, clamshell noteboo...
Bluetooth Smart SoC for wearable devices and the IoT
With the BCM20736 Bluetooth Smart system-on-a-chip, Broadcom has expanded its Wireless Internet Connectivity for Embedded Devices family. Addressing the rapidly growing market segments for wearables and the Internet of Things, the new BCM20736 WICED Smart chip supports A4WP wireless charging and enhanced data security modes.
FT121 G-Sensor shield focusses on Arduino-based gaming
Adding to its range of hardware solutions for those working with the Arduino open-source electronics development platform, FTDI Chip has announced the FT121 G-Sensor shield. Focussing on the implementation of Arduino-based gaming systems, the FT121 G-Sensor shield enables such projects to be conceived and subsequently executed simply and rapidly through its USB human interface device (HID) class support.
MoCA 2.0 Golden Node signals next step in home connectivity
Broadcom have announced that their BCM97428GN reference design has been assigned MoCA 2.0 Golden Node (GN) Certification. The reference design, based on the BCM7428 IP high definition (HD) set-top box (STB) platform, has achieved a MoCA 2.0 Golden Node which is the reference unit to which all MoCA 2.0 products are tested and certified by the Multimedia over Coax Alliance. The MoCA 2.0 standard is the next generation in home connectivity for mult...