Enclosures
New Tablet Style Enclosures From TEKO
TEKO have launched TEKWALL, a new range of ergonomic tablet style enclosures. These highly attractive multifunction housings are suitable for desktop, wall mounted and hand held electronics. Typical applications include medical and wellness devices, data collection equipment, building services systems, security and detection electronics, machine control, measurement instruments, and much more.
Versatile Veronex IP64 Flame Retardant Plastic Enclosures Combine Safety, Style And Functionality
Vero Technologies’ Veronex case is one of the most adaptable small enclosures on the market. It is available in three variants: IP64 sealed, hand-held and instrument cases. It is available in four plan sizes and nine heights in all versions. The Veronex family of small plastic instrument cases from Vero Technologies is extremely versatile, suitable for a wide variety of OEM, consumer electronics, electrical and instrumentation applications.
Sencio’s nCapsulate cuts system assembly costs
Sencio is bringing an extra dimension to sensor and MEMS encapsulation with the launch of its nCapsulate freeform packaging technology. nCapsulate offers complete freedom of shape when encapsulating semiconductor sensors or MEMS.
Hammond’s New Hand-Held Enclosures For Today’s Electronics: The 1553T And The 1599 Tablet
Designed for portable applications where touchscreens and electro-mechanical controllers such as joysticks and rollerballs are used, the new 1599 Tablet enclosure from Hammond Electronics features a low profile rounded ergonomic design, which fits comfortably into the hand to prevent operator fatigue during extended period of use.
Schroff Air Baffles Efficiently Dissipate Heat In MicroTCA.4 systems
Pentair has developed Schroff air baffles for both front and rear I/O that meet the MicroTCA sub-specification defined for the advanced physics community, known as MicroTCA.4. MicroTCA.4 incorporates additional rear I/O and precision timing enhancements to the MicroTCA base specification for performing and evaluating experiments on particle acceleration, photon behaviour, etc. at physical research centres.
New OKW Enclosures and Knobs Catalogue 2013
OKW has launched its new 2013 product catalogue which differs significantly from previous issues. The content-related appearance has been completely redesigned. Greater emphasis has been placed on design-in with a larger number of function and application-oriented product photos.
When Form Fits The Function, Why Change It?
While computer bus architectures come and go, there are good reasons why the Eurocard has remained the packaging form factor of choice for over 25 years. Martin Blake, Applications Manager with Verotec, takes a more in depth look in this article from ES Design magazine.
Rittal Launch LCP DX Cooling System
Rittal has today launched its range of DX based LCP cooling systems. Rated at 12kW, the Liquid Cooling Package Direct Expansion can be deployed in either cold aisle containment or high density rack cooling.
Staying Cool About Thermal Management
In this ES Design magazine article, Christian Lang, Marketing Manager at DSM Computer GmbH, explores principles and valuable tips for managing heat dissipation when using industrial PCs. Christian Lang studied Precision Engineering at Munich Technical University, and has worked as a Development Engineer, Project Manager and System Development Manager with Kontron GnbH and MSC Vertriebs GmbH before joining DSM Computer GmbH.
Choice of maxiGRIP Heat Sink Attachment Systems is Expanded by ATS
Advanced Thermal Solutions has added to its line of maxiGRIP attachment systems for fast, secure mounting of heat sinks to flip chips, BGAs and other hot PCB components. More than 200 variations of maxiGRIP are now available for use on a wide variety of IC packages.