Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

20th September 2011
Written by : ES Admin
Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011
Nihon Superior Co. Ltd., will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
SN100C (551CT) fluxed-cored solder wire combines the benefits of a eutectic lead-free alloy with a robust, high-temperature capable cored flux for high-speed sequential soldering. The cored flux is formulated for high soldering tip temperatures up to 380°C with good tip separation for reduced icicles, allowing fast wetting and high spreadability, The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected.

SN100C (551CT) is specifically designed for high-speed robotic soldering processes and the excellent wetting and high spread factor offers increased soldering speeds with hand soldering as well. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305. Now in the 12th year since its introduction, the SN100C lead-free alloy continues to displace SAC305 in many applications due to its high reliability, low copper erosion, and cost effectiveness.

Nihon Superior also will display several next-generation products that are completely halogen-free, which means there are no intentional additions of the halogens F, Cl, Br or even I hidden in the chemistry.

SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls. The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints.

SN100C P603 D4 and SN100C P605 D5/D6 dispensing grade lead-free solder pastes offer superior dispensing stability, ensuring no skipped pads. SN100C P605 D5/D6 is optimized for high precision dispensing for chip components down to 01005(0402 metric). Being completely halogen-free, these pastes help to achieve improved reliability, high productivity and cost reduction.

SN100C (044) completely halogen-free high performance flux-cored solder wire makes it possible to achieve a high first-pass yield due to its excellent wetting and spread, while providing approximately 30 percent faster soldering speeds in manual soldering when compared to the company’s previous halogen-free flux-cored solder wire.


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