Pending
New fast-cure, low-shrink adhesive from Intertronics
New from Intertronics is a fast-cure, low-shrink adhesive for optic assembly which eliminates parts movement – DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components, whilst its low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling.
OP-67-LS offers the ability to “cure on demand” with exposure to longwave UV and visible light, allowing maximum flexibility in positioning parts prior to cure. OP-67-LS features 0.2% linear shrinkage upon cure. OP-67-LS offers superior moisture resistance, very low outgassing, and adhesion to a variety of substrates including metal, glass, ceramic and polycarbonate, allowing its use in many critical and demanding applications such as fibre-optic “V” groove bonding, positioning laser diodes, fibre pig tailing, transceiver potting, VCSEL positioning and mounting active devices, or passive couplers, prisms and other optical device assemblies.
Product Spotlight
APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
| SKU: | |
|---|---|
| Stock: | 3490 |
| Cost: | $3.95 |
Upcoming Events
8th August 2024
China 1st and 2nd Floor, Area A, China Import and Export Fair Complex
