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Engineered Conductive Materials Introduces Low-Temperature Curing Conductive Adhesive DB-1541-LTC for OPV

29th July 2011
ES Admin
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Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces the DB-1541-LTC Low-Temperature Curing Conductive Adhesive for use in organic solar modules or other temperature-sensitive photovoltaic devices. This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 100°C.
The DB-1541-LTC can be cured as low as 100°C, but has a dispensing work life greater than 48 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. The DB-1541-LTC features a rubber-like flexibility that is ideal for flexible photovoltaic applications with high peel strength to withstand the stresses induced in reel-to-reel manufacturing processes. This material also can be fast cured at elevated temperatures (1 minute @ 180°C)

DB-1541-LTC is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

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