Memory
Embedded flash memory enables faster performance for smartphones
Toshiba has started sampling the 128GB version of the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilises the company’s 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtua...
FPGAs powered by high-performance GDDR6 memory
Memory and storage solutions provider, Micron Technology, has announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC seven nanometre process technology.
Single package PCIe with 96-layer 3D Flash memory
The introduction of the fourth generation of Toshiba Memory’s single package ball grid array (BGA) solid state drive (SSD) BG4 series was announced at CES 2019. Toshiba Memory’s new line-up of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centres.
SSDs are based on QLC 3D-NAND architecture
With the 660p series Intel is launching the first SSDs with QLC 3D-NAND-architecture on the market. They are characterised by a very high storage density and large capacities. The solid state drives in M.2 form factor with PCIe and NVMe are available with 512GB, 1TB and 2TB storage space from Rutronik UK.
16TB enterprise capacity hard disk drives
A new series of enterprise capacity hard disk drives has been announced by Toshiba Electronics Europe with the MG08 Series. The series is a large capacity 16TB Conventional Magnetic Recording (CMR) HDD. The product has 33% more capacity than today’s widely adopted 12TB drives, and 14% more capacity than prior 14TB models.
Automotive DRAM lead times cut to six weeks
Greatly reduced lead times for its DRAMs with -40°C to +105°C automotive temperature ratings have been announced by Alliance Memory. Responding to customer demand, the company now holds many parts in finished goods stock and in addition can promise lead times of just six weeks for its most popular automotive temperature range products.
High-performance industrial SD and microSD memory cards
Global broad-line stocking distributor Rutronik, has announced that Swissbit’s high-performance Industrial SD and microSD Memory Cards Series are now available. The SD and microSD Memory Cards are designed and tested to withstand extreme environmental conditions, and deliver sustained high performance and endurance in a variety of applications.
RAM support doubled for Server-on-Modules
Vendor of standardised and customised embedded computer boards and modules, congatec, has announced that its Intel Atom C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on three sockets. This is twice the previously supported capacity, potentially setting a milestone for COM Express Type 7 based designs, as memory is important for embedded edge server technologies.
SST-MRAM as a last-level cache at the five nanometre technology node
At the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the research and innovation hub in nanoelectronics and digital technologies, presented a power-performance-area comparison between SRAM- and SST-MRAM-based last-level caches at the five nanometre node.
Experiment confirms high-speed potential of STT-MRAM
A collaboration between Advantest and Tohoku University’s Center for Innovative Integrated Electronic Systems led by Tetsuo Endoh has successfully demonstrated operation of a high-writing-speed spin-transfer torque magnetic random access memory (STT-MRAM) using an Advantest memory test system.