Memory
3D flash memory provides new design flexibility
A fifth-generation BiCS FLASH three-dimensional (3D) flash memory featuring a 112-layer vertically stacked structure has been successfully developed by KIOXIA Europe. The company has plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of the calendar year 2020.
F-RAMs range boast no-delay data write
The Excelon range of advanced ferroelectric RAM (F-RAM) devices from Cypress Semiconductor is now in stock at distributor RS Components. An energy efficient non-volatile memory, Excelon offers fast write speeds with no delay, and an effectively unlimited lifespan.
Low power memory compiler programme opened for 30 days
SureCore is opening its low power memory compiler for 30 days to qualifying companies to evaluate the capabilities of its PowerMiser and EverOn standard SRAM IP products on low power metrics. The new service will prove particularly useful for constraint and compute intensive SoC designs.
Smart meter begins pilot program in Africa and Middle East
Adesto Technologies has announced that its Non-Volatile Memory (NVM) and Power Line Communications chips are designed into a new G3-PLC smart meter that is now in pilot production targeting utility providers in Tunisia, Egypt, and other countries.
Flash memory experts at embedded world 2020
Visitors can meet KIOXIA Europe (formerly Toshiba Memory Europe) at embedded world 2020, the international trade fair for advancements in and around embedded systems, including new developments for security in electronic systems, artificial intelligence (AI), Internet of Things (IoT), e-mobility, energy efficiency and more advancement for our digital world.
SATA SSD Products incorporating NVMSentry firmware
SMART Modular Technologies has announced the introduction of the ME1 and ME2 Series SATA Solid State Drive (SSD) products. The new ME1 and ME2 Series are the first SATA SSD products incorporating SMART Modular's proprietary NVMSentry firmware.
Mouser inks pact with non-volatile memory supplier
Mouser Electronics has agreed a distribution deal and partnership with GigaDevice, a provider of non-volatile memory solutions. As part of the agreement, Mouser Electronics is now an authorised distributor of GigaDevice SPI NOR, SPI NAND, and parallel NAND flash memory devices that are ideal for embedded applications such as automotive, consumer electronics, Internet of Things (IoT), industrial and mobile devices.
Memory subsystem solution for next-generation AI training chip
Rambus has announced that Enflame (Suiyuan) Technology has selected Rambus HBM2 PHY and Memory Controller IP for its next-generation AI training chip. Rambus memory interface IP enables the development of high-performance, next-generation hardware for leading-edge AI applications.
NAND Flash to lead all others as IC market growth returns in 2020
IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2020, which will be released in January 2020. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organisation (WSTS) through the year 2024. The top five categories for IC product growth are covered in th...
Paving the way to extreme scaling for logic and memory transistors
At this year’s IEEE International Electron Devices Meeting, imec, reported an in-depth study of scaled transistors with MoS2 and demonstrated best device performance to date for such materials. MoS2 is a 2D material, meaning that it can be grown in stable form with nearly atomic thickness and atomic precision. Imec synthesised the material down to monolayer (0.6nm thickness) and fabricated devices with scaled contact and channel length...