Memory

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Imec demonstrates breakthrough in ferroelectric memory

Imec demonstrates breakthrough in ferroelectric memory
Imec has announced at the 2017 Symposia on VLSI Technology and Circuits the world’s first demonstration of a vertically stacked ferroelectric Al doped HfO2 device for NAND applications. Using a new material and a novel architecture, imec has created a non-volatile memory concept with attractive characteristics for power consumption, switching speed, scalability and retention.
8th June 2017

Power management IC for car audio systems

Power management IC for car audio systems
A new system regulator IC has been launched by Toshiba Electronics Europe (TEE) that is designed to handle the increasing sophistication of car audio systems. The TCB010FNG is a fully-featured solution, incorporating the required power supply and all essential detection functions. TCB010FNG incorporates a multi-rail microcontroller power supply that retains power during minor interruptions in the battery supply. The device also includes multiple variable power supplies for flexibility, as well as a fixed power supply.
8th June 2017

Low-power embedded SRAM achieves battery-free operation

Low-power embedded SRAM achieves battery-free operation
The successful development of a new low-power SRAM circuit technology has been announced by Renesas Electronics. The technology can be embedded in application specific standard products (ASSPs) for Internet of Things (IoT), home electronics, and healthcare applications. The new technology provides a function for switching dynamically, with a low power overhead, between active operation, in which the CPU core performs read and write operations of the embedded SRAM, and the standby mode, in which the stored data is retained.
8th June 2017


Module suitable for low power embedded applications

Module suitable for low power embedded applications
A Qseven Rel. 2.1 compliant module has been released by SECO. The Q7-B03 is based on the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 SoCs. This solution can merge its high graphics performance and extreme temperature with power efficiency. and is available from Rutronik. The graphics of the Q7-B03 module include an integrated Gen9-LP graphics controller with 18 execution units, as well as 4K HW decoding and encoding of HEVC (H.265), H.264, VP8, SVC and MVC.
6th June 2017

Multimedia card suitable for embedded applications

Multimedia card suitable for embedded applications
Manufacturer of flash memory solutions, Swissbit, has announced its latest technology for the industrial market: the embedded multimedia card EM-20. The eMMC combines an industrial controller with reliable multi-level cell (MLC) flash in a BGA153 package making it possible to solder the memory directly onto the printed circuit board of the target application. With capacities from 8-64GB, all typical applications are covered. EM-20 replaces thus far commonly used NAND memory chips, which depend on elaborate operating system resources.
5th June 2017

Compact NVMe SSDs offer up to 1TB capacity

Compact NVMe SSDs offer up to 1TB capacity
A new line of NVM Express (NVMe) SSDs have been launched by Toshiba Electronics Europe (TEE). Integrating 64-layer, 3D flash memories, the XG5 series offers up to 1TB capacity in a compact M.2 form factor. Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.
31st May 2017

RoHS-compliant SRAMs offer low power consumption

RoHS-compliant SRAMs offer low power consumption
To meet the demand for high-density fast CMOS SRAMs, Alliance Memory has introduced new 8Mb and 16Mb x32 devices in the 90-ball 8x13mm TFBGA package. Providing space-saving alternatives to solutions in larger 119-ball packages, the devices are optimised for networking routers and switchers, test and medical equipment, and automotive applications. Featuring access times of 10ns and data retention voltages of 1.5V minimum, the 8Mb AS7C325632-10BIN and 16Mb AS7C351232-10BIN are configured as 256Kx32 and 512Kx32, respectively.
22nd May 2017

A better data storage in the making

A better data storage in the making
Techniques and coding theories in information sciences have helped to design new concepts for faster and better data storage. Rapid and reliable data storage is crucial for the success of businesses, online platforms, information repositories and research centres. The EU-funded INFO-STORE (Novel data storage by advancing information sciences) project investigated how to overcome challenges and limitations in emerging data storage applications.
15th May 2017

High-endurance memory card for surveillance applications

High-endurance memory card for surveillance applications
New industrial-grade microSDHC/XC memory cards have been launched by Apacer Technology which are custom-built for video monitoring equipment to endure long hours of continuous data writing. Not only are Apacer microSDXC UHS-1(U3) memory cards available in capacities ranging from 4-128GB, their Ultra High Speed Class 3 specification also supports smooth Full-HD, 3D and 4K video recording, which is particularly significant in video monitoring applications that require continuous recording and sustain high wear rate.
10th May 2017

Compact external hard drive unveiled at COMPUTEX Taipei 2017

Compact external hard drive unveiled at COMPUTEX Taipei 2017
At COMPUTEX Taipei, taking place 30th May to 3rd June 2017, Team Group will be exhibiting. 2017 is the twentieth anniversary of the establishment of Team Group. A total of four products, including gaming memory module and USB drive, have all won the 2017 COMPUTEX d&i awards. Unlike previous shows, this year the company will set up a VIP meeting room and a new product display area at the Grand Hyatt Taipei hotel.
5th May 2017


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