Memory
Industrial-quality memory and security products at electronica
Swissbit has announced that it will showcase robust and durable flash memory solutions for industrial applications at electronica virtual 2020, from November 9th to 12th, 2020 under the headline ‘Endurance with 3D-NAND’ with its Embedded IoT Solutions division exhibiting hardware-based security solutions designed to protect data and devices in Internet of Things applications.
3DIC Compiler solution for high-bandwidth memories
Synopsys has announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth memories (HBMs) in a single package.
DDR4 rugged SODIMM anti-vibration memory released
Apacer has released a robust DDR4 Rugged SODIMM anti-vibration memory module, which is targeted at defence and industry applications that suffer from high-vibration environments. It can help industrial vertical markets such as 5G base stations, energy exploration, wind power generation, aerospace defence, railways and transportation systems painlessly upgrade rugged applications to make them more robust.
ActiveStor data storage supports 4D modelling research
Researchers at MINES ParisTech have implemented Panasas ActiveStor high-performance computing (HPC) data storage to support the rapidly growing research efforts at the university’s Materials Research Centre. MINES ParisTech, which conducts €30 million in annual research contracts, needed to expand its HPC data storage capacity to take on an increasing load of research to drive further discoveries.
SK hynix launches 16 gigabit DDR5 DRAM
SK hynix has announced the launch of its DDR5 DRAM, a high-speed and high-density product optimised for big data, Artificial Intelligence (AI), and machine learning (ML) as a next generation standard of DRAM.
I-fuse OTP memory solution on X-FAB 130nm RF-SOI
X-FAB Silicon Foundries and with Attopsemi, have entered into a collaboration to satisfy the memory requirements of 5G technology. The companies have announced successful qualification of Attopsemi’s I-fuse OTP memory in relation to X-FAB’s XR013 open-platform foundry 130nm RF-SOI technology.
SMART Modular DuraFlash eMMC for embedded applications
SMART Modular Technologies has announced its new BGAE440 family of eMMC (embedded MultiMediaCard) products under the brand name, DuraFlash. DuraFlash is SMART Modular’s designation for durable Flash memory solutions that are built to higher standards to deliver the durability and reliability expected in industrial embedded market segments.
8Gb SDRAMs help increase smartphone battery life
To meet the increasing demand for higher-density CMOS DDR4 SDRAMs, Alliance Memory has expanded its portfolio with two new 8Gb devices.
Swissbit EM-30 industrial grade 3D-NAND e.MMC-5.1 BGA
Swissbit has extended its range of miniaturised storage solutions with the launch of its EM-30 device with an e.MMC-5.1 standard interface. The BGA package combines a modern controller with industrial grade 3D-NAND and firmware that supports the most demanding applications. Available in capacities from 16 to 256GB, EM-30 offers significant cost savings over former 2D-NAND solutions.
SPI NAND flash memory handles boot code and data storage
To meet the growing demand for serial peripheral interface (SPI) NAND flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory has released the new AS5F series of 1.8V to 3V devices with densities from 1Gb to 8Gb and high-speed clock frequencies up to 120MHz.