Free electronica seminars focus on high speed interconnect
Free seminars will be on offer at Samtec’s stand during the electronica exhibition in Munich (Nov 11-14). The seminars focus on high speed interconnect design considerations, and will be presented by Scott McMorrow, President and SI Consultant of Teraspeed Consulting. They are 20 minutes in duration. Reservations are not required, and time will be available afterwards for questions and discussion.
The topics include:
* PCB Material Selection For High Speed Design: This seminar will discuss different types of laminate systems that can be chosen for various design applications. We will emphasize the predictability of losses, the use of various types of copper foil treatments, and the impact of fiberglass weave.
* Connector Figures Of Merit: This seminar will discuss relative figures of merits for connectors and how to use them in selecting a connector for a particular design. Emphasis will be on data available on-line from Samtec.
* High Fidelity Signal Integrity Modelling: This seminar will discuss the need for precise signal integrity modeling for high performance systems. This will include a discussion on making accurate measurements, material properties, benchmarking of electromagnetic solvers to measurements, and statistical analysis.
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