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congatec Articles

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Design
2nd March 2011
congatec presents a COM Express Compact mini carrier board for quick design-in

congatec AG introduces the new conga-MCB, a mini carrier board for COM Express Compact modules that is perfect for space-critical applications. It is ideal for the quick construction of prototypes but can also be used for high performance mobile applications.

Design
2nd March 2011
congatec presents new COM Express Compact module based on Intel® Atom(tm) E6xx processor series

congatec AG introduces the conga-CA6 module, which is based on the new Intel Atom E6xx processor series and the Intel Platform Controller Hub EG20 for COM Express Type 2. All components of this embedded design are specified for the industrial temperature range of -40 to +85°C, making the conga-CA6 an ideal solution for extreme applications.

Design
2nd March 2011
congatec future-proofs ETX and XTX standard

congatec AG is giving the ETX and XTX form factors a viable future with the integration of AMD Fusion technology. Modules based on AMD Fusion processors deliver significant improvements with regard to performance and scalability.

Communications
3rd February 2011
congatec - COM Express Basic Module with AMD Fusion Technology

congatec AG, a leading manufacturer of embedded computer modules, introduces a new COM Express product line based on the AMD Embedded G-Series platform. The integration of AMD Fusion technology expands the COM Express standard with a completely new processor architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful CPU and an even more powerful graphics performance, excellent performan...

Communications
3rd February 2011
congatec - COM Express small form factor module based on 2nd Generation Intel Core processor family

congatec AG extends its Intel® processor-based COM Express product family with the new highest performance module conga-BM67. It features the latest 2nd Generation Intel® Core™ processors such as the Intel® Core™ i7-2710QE processor (2.1 GHz, 45W, PGA) and the dual-core Intel® Core™ i5-2510E processor (2.5 GHz, 35W, PGA) with up to 8 GByte dual channel DDR3 memory (1333 MHz).

Communications
19th January 2011
congatec unveils new COM Express Basic Module with AMD Fusion Technology

congatec AG, a leading manufacturer of embedded computer modules, introduces a new COM Express product line based on the AMD Embedded G-Series platform. The integration of AMD Fusion technology expands the COM Express standard with a completely new processor architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful CPU and an even more powerful graphics performance, excellent performan...

Communications
6th January 2011
congatec announces new COM Express small form factor module based on 2nd Generation Intel Core processor family

congatec AG extends its Intel® processor-based COM Express product family with the new highest performance module conga-BM67. It features the latest 2nd Generation Intel® Core(tm) processors such as the Intel® Core(tm) i7-2710QE processor (2.1 GHz, 45W, PGA) and the dual-core Intel® Core(tm) i5-2510E processor (2.5 GHz, 35W, PGA) with up to 8 GByte dual channel DDR3 memory (1333 MHz).

Design
15th December 2010
congatec to showcase new COM Express module with high performance graphics at the ICE gaming show in London from 25-27 January 2011

congatec AG, a leading manufacturer of embedded computer modules, is expanding its COM Express line with a new module featuring powerful graphics performance that stands out in many ways. Both high-definition multimedia content, as well as the latest 3D games, can be played seamlessly with a processor TDP (thermal design power) of under 10 watts.

Communications
23rd November 2010
congatec COM Express modules at the heart of Intel's Embedded Building Blocks initiative

Under the auspices of Intel Corporation and in cooperation with TQ-Group and apra-norm, congatec AG has launched the Embedded Building Blocks initiative to make it easier for small and medium-sized businesses (SMEs) to gain access to embedded computer technology and entry into the industrial computer market.

Communications
23rd November 2010
congatec Ultra compact embedded Qseven Starter Kit for industrial automation

congatec AG, a leading manufacturer of embedded computer modules, presents the first Qseven Starter Kit for automation. Low power consumption makes the Qseven an ideal platform for building small computer units and terminals within the automation industry. To accelerate the development of such applications, congatec has introduced the Qseven Mobility Kit as a complete design solution.

Communications
23rd November 2010
congatec conga-QA6 supports CAN bus in accordance to the Qseven 1.2 specification

congatec AG, a leading manufacturer of embedded computer modules, announces CAN (Controller Area Network) bus support on the conga-QA6 small form factor (SFF) Qseven module. This is the first congatec Qseven module to support this interface.

Analysis
9th November 2010
congatec provides full DisplayPort Support for COM Express Type 2

congatec AG, a leading manufacturer of embedded computer modules, announces support of up to three DisplayPort video interfaces for the current Type 2 COM Express modules conga-BM45 and conga-BM57.

Analysis
9th November 2010
congatec AG presents UEFI support on Qseven with new Intel® Atom™ Processor E600 Series

congatec AG, a leading manufacturer of embedded computer modules, announces UEFI support for the new conga-QA6 small form factor module. UEFI stands for Unified Extensible Firmware Interface.

Analysis
9th November 2010
congatec Unveils New COM Express Basic Module with ECC Support

congatec AG, a leading manufacturer of embedded computer modules, adds the conga-BE57 to its COM Express product family. Designed for DDR3 ECC SODIMM memory modules and equipped with extremely low power Intel® processors in a BGA package, the conga-BE57 is particularly suitable for mission critical applications.

Analysis
8th November 2010
congatec records significant third quarter growth

congatec AG continues its upwards trend recording a significant sales increase for the third quarter of 2010. In the first nine months of 2010 the company achieved overall revenue of 32 million Euro from the sales of embedded computer modules and accessories. This represents an increase of 86% over the same period last year.

Analysis
19th October 2010
congatec opens office in Scandinavia as part of its European growth initiative

congatec AG, a leading manufacturer of embedded computer modules, announces the appointment of Lars Hallberg as Territory Manager for Sweden, Denmark, Finland and Norway. Based at congatec's new Nordic sales and marketing office, Mr Hallberg will be responsible for the multi-channel distribution strategy that includes both partner and direct sales.

Communications
15th September 2010
congatec presents conga-QA6, an ultra-mobile module featuring the new Intel Atom Processor E6xx series

congatec AG, a leading manufacturer of embedded computer modules, presents conga-QA6, an extended temperature range small form factor module. The conga-QA6 is based on the Qseven® mobile standard and is equipped with the new Intel® Atom(tm) processor E6xx series as well as the Intel® Platform Controller Hub EG20T. All components of this design are specified for an industrial temperature range of -40°C to +85°C.

Analysis
23rd August 2010
congatec AG sales up by a staggering 61%

congatec AG, a leading manufacturer of industrial computer modules, reports sales of Euro 18.9 million for the first six months of 2010. When compared to 2009 revenue, which stood at Euro 11.7 million after the first six months, congatec has so far achieved an overall increase of 61.5% in revenue for 2010.

Analysis
16th August 2010
congatec continues to expand its sales organization in Europe

congatec AG, a leading manufacturer of embedded computer modules, announces the appointment of Bob Pickles as Business Development Manager for the UK. Based at congatec's new UK sales and marketing office, Mr Pickles will be responsible for the multi-channel distribution strategy that includes both partner and direct sales.

Communications
9th July 2010
Tough terminals – PC requirements for harsh logistics environments

DLoG GmbH, a leading provider of rugged industrial computers headquartered in Germany, with offices in the UK, Sweden, NL and USA, is currently developing particularly robust and mobile industrial PCs for use in forklift trucks and other vehicles. High demands are made on computers used in the transport and logistics sector due to the harsh environmental and operating conditions. In order to meet these challenges and to be able to react flexibly ...

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