congatec

Address:
Auwiesenstr. 5
Deggendorf
94469
Germany

Phone: +49 991 27000

Web: www.congatec.com


congatec articles

Displaying 1 - 20 of 135

Mini-ITX and Pico-ITX boards feature security enhancements

Mini-ITX and Pico-ITX boards feature security enhancements
The conga-PA5 Pico-ITX single board computer and the conga-IA5 Thin Mini-ITX motherboard, two industrial-grade, long-term available computing platforms featuring the latest Intel Atom, Celeron and Pentium processors, has been introduced by congatec. System engineers can immediately deploy them to upgrade existing Pico-ITX and Mini-ITX designs and benefit from approximately 30% more processing power and 45% more graphics performance compared to the previous generations.
15th November 2016

Quick Starter Kit for SMARC 2.0 aids Intel Atom processors

Quick Starter Kit for SMARC 2.0 aids Intel Atom processors
congatec presents the SMARC 2.0 Quick Starter Kit for Intel Atom processors (code name Apollo Lake). The kit comes with congatec’s first SMARC 2.0 module – the conga-SA5 – and everything developers need for the immediate evaluation of the new SMARC 2.0 standard as well as the latest Intel Atom processor generation. Application engineers of connected Industry 4.0 and wireless IoT devices will love the option of the integrated wireless interfaces with standardised antenna connectors on board.
15th November 2016

Low power processor modules available for every budget

Low power processor modules available for every budget
congatec has released COM Express Compact and Qseven Computer-on-Modules in time with the launch of Intel’s low-power processors (code name Apollo Lake). The modules with Intel Atom, Celeron and Pentium processors feature the powerful Intel Gen 9 graphics and deliver an impressive performance per watt improvement, enabling the implementation of even more powerful designs with even lower energy consumption.
26th October 2016


First COM Express Type 7 modules with Intel Xeon D processors

First COM Express Type 7 modules with Intel Xeon D processors
Parallel to the preview release of the COM Express Type 7 specification, congatec is introducing new Server-on-Modules with Intel Xeon D processors (codename Broadwell). Based on the COM Express Basic standard form factor (95x125mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48GB of DDR4 ECC RAM.
13th October 2016

Embedded COM tech supports new module specification

Full support of the new SMARC 2.0 specification, which was released by the Standardisation Group for Embedded Technologies e.V. (SGET) just a few days ago has been announced by congatec. This major technology adaption extends congatec’s leading and extensive COM portfolio to include a brand new solution which is perfectly positioned between Qseven and COM Express.
1st July 2016

Server-on-Modules enable real-time media processing

Server-on-Modules enable real-time media processing
congatec has introduced two Server-on-Modules based on the latest Intel Xeon E3-1578L and E3-1558 processors, which have been designed for real-time media processing. The conga-TS170 modules feature integrated Intel Iris Pro Graphics accelerated by 128MB fast eDRAM and double graphics base frequency for outstanding transcoding and video processing performance.
9th June 2016

Modules integrate most cost efficient Intel Celeron processor

Modules integrate most cost efficient Intel Celeron processor
congatec increases the scalability of its COM Express Computer-on-Modules with two entry-level models based on the latest Intel 14nm microarchitecture (formerly codename Skylake). The Intel Celeron processor-based COM Express Basic and Compact modules combine cost efficient dual-core CPU performance with state of the art features such as 4k multiscreen support, high-speed DDR4 RAM with increased bandwidth and four USB 3.0 ports.
19th May 2016

A roadmap for SMARC 2.0, Qseven 2.1 & COM Express 3.0

A roadmap for SMARC 2.0, Qseven 2.1 & COM Express 3.0
  congatec has announced that it fully supports the upcoming new SGET and PICMG CoM specifications SMARC 2.0, Qseven 2.1 and COM Express 3.0. Modules complying with these standards are already in development and will be announced in time with the launch of the next processor generations.
2nd March 2016

COM Express module is based on AMD G-series SoC

COM Express module is based on AMD G-series SoC
Expanding its COM Express portfolio, congatec has launched a module based on the AMD G-Series SOC (called Brown Falcon). Compared to modules based on the previous generation of AMD Embedded G-series SOCs, the conga-TR3 with dual-core AMD GX-217GI processor provides up to 30% more graphics performance and 15% more overall system performance.
2nd March 2016

Server-on-modules feature Intel Iris Pro graphics

Server-on-modules feature Intel Iris Pro graphics
Expanding its COM Express Basic Server-on-Module portfolio, congatec has announced a module featuring the Intel Xeon Processor E3-1515M v5, fast DDR4 memory and Intel Iris Pro graphics. The GPU of the conga-TS170 provides 128MB eDRAM and with 72 execution units it has three times more parallel execution power than the Skylake architecture without Iris graphics.
2nd March 2016

6th gen Intel Core Thin Mini-ITX boards are highly scalable

6th gen Intel Core Thin Mini-ITX boards are highly scalable
congatec has announced a family of highly scalable Thin Mini-ITX boards with Intel processors - from from 2.0GHz Intel Celeron up to 3.4GHz Intel Core i7. The conga-IC170 Thin Mini-ITX boards offer a fully configurable thermal design power from 7.5 to 15W and up to 32GB of DDR4 RAM as well as 4K multiscreen support.
2nd March 2016

congatec lowers the price threshold for 64bit x86 computing

congatec  lowers the price threshold for 64bit x86 computing
congatec has introduced highly cost-effective versions of its existing COM Express and Qseven modules as well as Mini-ITX boards. They are all equipped with the strategically low-priced, long-term available Intel Atom x5-E8000 processor. This 64bit quadcore processor significantly lowers the entry threshold of powerful x86 computing and, now also in terms of price, offers developers a true alternative to competing platforms based on ARM technology.
11th February 2016

ETX & XTX module life cycle extended until 2019

ETX & XTX module life cycle extended until 2019
congatec has extended the life cycle of their AMD processor-based ETX and XTX computer modules at least until the end of 2019, extending the module availability from the usual 7 years to 12-14 years. The conga-ELX, conga-ELXeco and conga-XLX modules were launched in 2005 and 2007 with AMD Geode LX 800 500MHz processors. This announcement effectively doubles the standard availability of embedded x86 processor technology.
22nd January 2016

COM Express modules offer rich graphics & support HSA 1.0

COM Express modules offer rich graphics & support HSA 1.0
congatec AG has introduced COM Express basic modules parallel to AMD's launch of its next-gen high-end embedded processors. The conga-TR3 modules with dual- or quad-core AMD Embedded R-Series SOCs offer not only a much more broadly scalable TDP from 12 to 35W over earlier modules and a significantly improved performance per watt but two added features: high-performance AMD Radeon graphics as well as full support of the HSA specification 1.0.
29th October 2015

Powerful graphics capabilities define Thin Mini-ITX motherboards

Powerful graphics capabilities define Thin Mini-ITX motherboards
congatec AG is to extend its industrial-grade Thin Mini-ITX motherboard portfolio to include graphics-rich conga-IA4 boards with 14nm Intel Pentium and Celeron processors (codenamed Braswell) and full Windows 10 support. Compared to their predecessors, the Thin Mini-ITX boards offer increased computing and graphics performance as well as support for up to three 4k displays.
22nd October 2015

COM Express Mini modules allow passive cooling

COM Express Mini modules allow passive cooling
congatec AG extends its portfolio of credit card-sized computer modules by integrating the 14nm Intel Pentium and Celeron processors (codenamed Braswell) on COM Express Mini modules. The conga-MA4 module enhances performance density, however heat dissipation has been lowered to a SDP (Scenario Design Power) of 4W, enabling very compact, passively cooled system designs.
13th October 2015

COM Express modules support up to three displays & 4k

COM Express modules support up to three displays & 4k
congatec has announced the conga-TCA4, the company's first COM Express compact module based on the Intel Pentium and Celeron processors (codenamed Braswell). The robust COM Express modules consume just 4W on average while providing increased graphics capabilities and overall performance. Up to 16 graphics execution units can support up to three HD displays or two 4k displays and achieve a theoretical peak performance of 358.4GFlop/s.
30th September 2015

µQseven modules pack performance into tiny footprint

µQseven modules pack performance into tiny footprint
congatec is extending its product portfolio for the most popular Qseven standard by now offering COMs in the 40x70mm sub-credit-card µQseven format. The first flagship module of this next-gen mini form factor is the conga-UMX6 with ARM Cortex A9-based Freescale i.MX 6 processors. It caters to applications in harsh environments, which require compact low-power designs, appealing multimedia and computing performance.
25th September 2015

COM Express modules feature a 15W configurable TDP

COM Express modules feature a 15W configurable TDP
  Four COM Express compact modules have been introduced by congatec, parallel to the launch of the new 6th generation Intel Core processors. The devices are specially designed for challenging applications that demand high performance in sealed, fanless system designs.
3rd September 2015

Mini-ITX boards feature powerful graphics & low TDP

Mini-ITX boards feature powerful graphics & low TDP
congatec has announced the expansion of its industrial-grade Mini-ITX motherboard portfolio with two highly efficient low-power conga-IGX variants that are based on the Gen 2 AMD Embedded G-Series SoC processor (codenamed "Steppe Eagle") and feature powerful SoC integrated AMD Radeon graphics. The low-power motherboards are scalable with a TDP ranging between 5 and 15W max.
23rd July 2015


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