Around the Industry

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Fraunhofer & RoodMicrotec partner

Expanding their existing cooperation, RoodMicrotec and Fraunhofer Institute for Integrated Circuits IIS aim to offer their customers complete solutions throughout the whole supply chain, from ASIC design to volume production. Fraunhofer IIS will provide their customers with a more efficient and complete supply chain solution from concept through all processes of design, manufacture, assembly, electrical test, qualification and finally delivery of the end-product ready for volume production.
22nd December 2014

IoT boosts embedded systems growth

Since 2006, there have been more embedded systems, industrial equipment, sensor devices, instruments, meters, cameras, animals and other objects connected to the internet than humans using computers, smartphones and other electronics. Until recently, steady increases in internet-connected things have been overshadowed by major market battles in smartphones and the emergence of tablet computers, but with growth rates easing in those end-use systems segments, the enormous potential of the IoT has become the hottest topic in electronics and the IC industry.
22nd December 2014

HMS ships three millionth Anybus module to Bosch Rexroth

HMS ships three millionth Anybus module to Bosch Rexroth
Used mainly to connect welding and tightening controllers to the various control systems used in automation technology, HMS Industrial Networks announces that it has shipped its three millionth Anybus module to Bosch Rexroth. Providing multi-network connectivity for the major network standards, Anybus embedded products are interchangeable communications modules for different fieldbus and industrial Ethernet networks.
22nd December 2014


Exar signs HDCVI technology agreement with Dahua

Exar has signed a strategic agreement with Dahua to license HDCVI (High Definition Composite Video Interface) technology. Under the terms of the new agreement, Exar is licensed to design, manufacture and sell analogue HD video solutions utilising HDCVI technology.
22nd December 2014

TSV’s added-value is important, says Yole

According to Yole Développement, 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications. Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube have all brought devices to the market that integrate 3D TSV technology.
22nd December 2014

2.5Gbit/s, 5Gbit/s Ethernet technology lands in Europe

Ismosys has signed a pan-European sales and marketing repping agreement with Aquantia. Ismosys Managing Director Nigel Watts is keen to get Aquantia’s new AQrate PHY technology, with its ability to carry an unprecedented 2.5 and 5Gbit/s Ethernet over up to 100m of legacy Cat 5e and Cat6 cables onto the market.
22nd December 2014

Live printed electronics demo set for Munich show

Live printed electronics demo set for Munich show
Thousands of electronic elements printed onto film or paper in a few hours will be one of the features at the LOPEC 2015 exhibition and conference in Munich (March 3-5, 2015). A Demo Line at the event will show how it's done. During the fair, a complete production line will produce examples of printed electronics "to go".
22nd December 2014

Large-scale stationary energy is key to a smarter power grid

According to Lux Research: large-scale stationary energy is key to a smarter power grid and for integration of intermittent renewables; Redox flow batteries are touted as an emerging option, but have been too expensive; and now, falling costs will carve out a 360MWh market in 2020, worth $190m.
19th December 2014

Instantly view 3D models for board-to-board connectors

Instantly view 3D models for board-to-board connectors
Following customer liaison, Global Connector Technology (GCT) has expanded its 3D model offering for board-to-board connectors. To meet the demand for instantly viewable 3D models, the company has released a system which posts models online for IGES, STEP and Parasolid files. This allows customers to download a representative selection of models and request the necessary GCT part numbers.
19th December 2014

IDT ships 3m low-power PCIe Gen3 buffers

IDT ships 3m low-power PCIe Gen3 buffers
  Cementing its role as a key enabling and validation partner of leading x86 and ARM-based CPU and chipset suppliers, Integrated Device Technology has announced that it has now shipped over 100m PCIe buffers and over 3m low-power PCIe Gen3 buffers.
19th December 2014


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