Around the Industry

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Leti presents latest R&D results

In keeping with its mission to develop photolithography alternatives for advanced technology nodes and offer competitive solutions adapted to specific applications, Leti is developing technologies for directed self-assembly lithography (DSA), massively parallel electron beam lithography and nanoimprint lithography. Leti, a research institute at CEA Tech, will present its latest results in these approaches for fabricating advanced CMOS and silicon photonics devices and sensors in several papers at the SPIE Advanced Lithography conference in San Jose, Calif., Feb. 26-March 2.
23rd February 2017

Europe's late stage tech funding market falls behind US

Europe's late stage tech funding market falls behind US
Europe is much further behind the US in late stage tech investing than it appears, according to analysis by Magister Advisors. Late stage tech funding is far behind the US, and surprisingly over a third of funding rounds in Europe target non-tech e-commerce or marketplace businesses. Magister Advisors identified 171 Series C, D and E funding rounds across Europe since 2011, using PitchBook. 
23rd February 2017

Anti-counterfeiting event heads for London

Anti-counterfeiting event heads for London
The agenda for the 8th Anti-Counterfeiting Forum seminar, which is to be held on Wednesday 22nd March at the Grange Rochester Hotel in central London, already has a strong line up of informative and topical presentations.
22nd February 2017


Design house offers free feasibility study

Design house offers free feasibility study
A free feasibility study to designers and OEMs faced with an urgent project, a design resource limitation or a complex electronic design problem is now on offer from LDD Technology, the electronic design consultancy. LDD can offer PGA or programmable logic expertise including embedded software development and can ensure that the most suitable designs employing the latest technologies are created, including the use of FPGAs, embedded processors and SOCs, where appropriate.  
22nd February 2017

Made (right) Here (right) Now

Made (right) Here (right) Now
  The UK-wide initiative to encourage more young people into manufacturing as a career, Made Here Now, is celebrating a major milestone with the launch of a new website at MadeHereNow.com, containing inspirational videos, success stories and photography.
22nd February 2017

Future Electronics bolsters NFC offering

Future Electronics bolsters NFC offering
Future Electronics has signed worldwide distribution agreements with Smartrac and Elatec which enable it to supply customers with a comprehensive choice of NFC, HF and UHF tag ICs and inlays, reader ICs and reader modules. Smartrac is a manufacturer of NFC, HF and UHF inlays. Inlays are tag labels which may be applied to almost any end product or package for data-rich, wireless identification. Germany-based Elatec supplies integrated, certified NFC modules operating in the low-frequency and high-frequency bands.
22nd February 2017

RS signs SEGGER to worldwide deal

RS signs SEGGER to worldwide deal
RS Components (RS) has signed a global distribution agreement with SEGGER Microcontroller, a leading supplier of development and debug tools, production programmers, RTOS and a full range of middleware, cryptographic and security software for a large range of microprocessors and microcontrollers from top semiconductor manufacturers.
22nd February 2017

Nano-trampoline probes quantum behaviour

Nano-trampoline probes quantum behaviour
A research group from Bar-Ilan University, in collaboration with French colleagues at CNRS Grenoble, has developed a unique experiment to detect quantum events in ultra-thin films. This novel research, to be published in the scientific journal Nature Communications, enhances the understanding of basic phenomena that occur in nano-sized systems close to absolute zero temperature.
22nd February 2017

Flemish government supports local innovation

Flemish government supports local innovation
  The research and innovation hub in nanoelectronics and digital technology, imec, and the Flemish government have announced a five year strategic commitment that aims at strengthening the pioneering role of Flanders’ research hub. 
22nd February 2017

Supercomputer TSUBAME3.0 scheduled to operate in summer 2017

Supercomputer TSUBAME3.0 scheduled to operate in summer 2017
  The Tokyo Institute of Technology (Tokyo Tech) Global Scientific Information and Computing Center (GSIC) has started development and construction of TSUBAME3.01—the next-generation supercomputer that is scheduled to start operating in the summer of 2017.
22nd February 2017


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Mobile World Congress 2017
27th February 2017
Spain Fira Gran Via and Fira Montjuïc
Wearable Technology Show 2017
7th March 2017
United Kingdom ExCel, London
embedded world 2017
14th March 2017
Germany Nürnberg Messe
electronica China 2017
14th March 2017
China Shanghai New International Expo Centre
Southern Manufacturing
21st March 2017
United Kingdom FIVE, Farnborough