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| Check out how the newest high-performance, Arm®-based Sitara™ AM2x MCUs are revolutionizing the industry. |
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| After remaining essentially unchanged for more than 25 years, the Subscriber Identity Modules (SIMs) used to authenticate devices onto cellular networks are undergoing a dramatic transformation, moving from physical hardware to downloadable software – embodied by the concept of eSIMs. Cyril Caillaud, NXP Semiconductors, explains. |
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| Goodix Technology has released its first NB-IoT system-on-chip (SoC) solution, the GR851x series that fully supports 3GPP Rel-14 and Rel-15 standards. Integrating an ultra-low power OpenCPU application system, it delivers stability and high security, providing a competitive cellular IoT solution for diverse application scenarios, such as smart cities, consumer electronics, Industry 4.0, and smart agriculture. The innovation will contribute to the greater construction of a modern, connected, and intelligent digital world. |
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| 3M is introducing Glass Bubbles from 3M for 5G, the newest member of its high-strength hollow glass bubbles product line, provides a unique, low-loss high speed high frequency (HSHF) resin additive for composite materials that designers use to build 5G devices and assemblies. 3M Glass Bubbles help designers enable products that can meet the rigorous transmission requirements and increased power demands that come with 5G implementation, while lowering the per volume cost of raw materials. |
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| When it comes to reducing emissions across the automotive landscape, commercial vehicles play a critical role. The global enactment of regulations to limit CO2 emissions from new heavy-duty commercial vehicles in particular poses major challenges for OEMs. FEV offers a wide range of solutions for future commercial vehicles to meet even the strictest specifications among different applications. In addition to advanced powertrain and propulsion systems, this includes innovative aerodynamic approaches and predictive vehicle controls based on various parameters such as commercial vehicle routes. |
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| Coordinated by Infineon Technologies AG, the research project Design methods and hardware/software co-verification for the unique identifiability of electronic components has begun operations. 12 partners from the research and academic sectors as well as from electronics and end user industries are working together to develop a holistic security concept for the Internet of Things. The VE-VIDES goal is to already systematically identify potential security gaps in the design phase and to use automatically generated, trustworthy mechanisms to protect electronic systems against attack. The German Federal Ministry of Education and Research is supporting the project as part of its funding measure Trustworthy Electronics. |
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| After completing a successful pilot project, German retailer EDEKA has equipped its latest store entirely with NICHIA technology. NICHIA LED technologies are increasingly being used in retail to push the shopping experience to the next level. The most recent project is an EDEKA store in Wiesbaden-Sonnenberg, Germany, which opened its doors in May 2021 and is equipped with a lighting solution entirely based on NICHIA technology. |
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| Thomas Neu, System Engineer for High-Speed Data Converters, Texas Instruments (TI), discusses the present day issue of elaborate filtering that can be required for industrial data-acquisition on the analogue front end (AFE) in front of the analogue-to-digital converters (ADCs). |
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| Three electronics manufacturers are among 60 digital leaders now with the vision and the skills to pursue smarter manufacturing through Made Smarter’s innovative Leadership Programme. |
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| For most product designs, using standard power systems is considered the most cost-efficient option compared to a configurable part. However, the power supply specification must be given careful deliberation. David Cadars, Technical Development Manager Power / EMech at TTI Europe explains. |
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