Design
Calibre PERC platform enables tandem analysis
The qualified Calibre PERC reliability rule decks from United Microelectronics (UMC) for their 28nm technology are now available it has been announced by Mentor Graphics. Customers of UMC can now extend their use of Mentor-based flows to incorporate advanced electrical reliability analysis that evaluates a variety of Electrostatic Discharge (ESD) protection features.
Architecture features submicrosecond interrupt responses
The ThreadX RTOS from Express Logic now provides Symmetric Multiprocessing (SMP) support on the ARMv8-A 64-bit processor family, including the ARM Cortex-A53, Cortex-A57 and Cortex-A72 processors. ThreadX SMP is based on Express Logic’s industry-leading ThreadX RTOS, a small, highly efficient embedded OS that minimises system overhead and provides lightning-fast, real time response.
Polyamides changing the game in metal replacement
Global science-based company active in health, nutrition and materials, Royal DSM, is making a move to substitution of die-cast metals and expensive high performance engineering thermoplastics like PEEK with the launch of a polymer at K 2016. ForTii Ace, a polyphthalamide (PPA) based on 4T chemistry, has an outstanding set of mechanical, thermal and chemical properties.
Users harness power of design to create powerful experiences
The launch of SOLIDWORKS 2017 has been announced by Dassault Systèmes, the 3DEXPERIENCE company, and in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions. From small start-ups to global organisations, more than 3.1 million users can create multi-sensory experiences through innovative product design, with access to easy 3D design and development applications anytime, anywhere and on any device.
Industrial motherboard designed for customisation
Manufacturer of industrial computer products, Axiomtek, is to introduce the IMB500, an industrial ATX motherboard powered by the 6th gen Intel Core, Pentium and Celeron processors (formally codename Skylake) in the LGA1151 socket with Intel Q170 chipset. The IMB500 supports four 288-pin DDR4-2133/1866 SO-DIMM sockets with a memory capacity of 64GB to enhance overall system performance.
Learn to program pack covers open source computers trio
Three new editions of the MathWorks Learn to Program pack, for the Raspberry Pi3, Arduino Uno and BeagleBone Black are now in stock at Farnell element14. The packs provide access to all the necessary hardware and software to get started including the board and MATLAB and Simulink Student Suite.
What agile or hybrid methodology to use for autonomous cars
When planning an Agile software development project for a hardware product design, project design strategy can be greatly simplified by choosing a development environment that is designed for use with your industry standards. It is even more important when the product safety is a key concern, requiring compliance with a range of strict safety related standards.
Würth announces Micropower flyback transformers
In partnership with Linear Technology, Wurth Electronics Midcom introduces the new flyback transformers for LT8303 and LT8304 reference designs. The LT8303 operates from an input voltage range of 5.5V to 100V and can deliver up to 5W of isolated output power, while the LT8304 operates from an input voltage range of 3V to 100V and can deliver up to 24W of isolated output power.
3D design for mobile microbatteries
In the race towards miniaturisation, a French-US team-mostly involving researchers from the CNRS, Université de Lille, Université de Nantes and Argonne National Laboratory (US) as part of the Research Network on Electrochemical Energy Storage (RS2E)1-has succeeded in improving the energy density of a rechargeable battery without increasing its size (limited to a few square millimeters in mobile sensors).
IP core delivers high performance for SoC applications
A high performance, dual issue version of Cortus' APS25 IP core has been released. The APS29 is the fourth in a family of products based on the Cortus v2 instruction set. The core is aimed at embedded systems requiring good computational performance while also delivering efficient silicon area and modest power dissipation.