Communications
Melexis Further Expands LIN Transceiver Offering with New Device That Exhibits Strong EMC/ESD Behavior
Automotive specialist Melexis, has added to its portfolio of devices supporting the local interconnect network (LIN) bus. The new MLX80030, which comes in a compact SOIC8 package, is 3rd member of the company’s next generation of system basis ICs that enable simple and effective development of LIN slaves. Pin-to-pin compatible with established LIN devices, such as the ATA6623/29 and TJA1028, this IC combines a physical layer LIN transceiver...
CSR announces launch of second generation Bluetooth Smart platforms
CSR today announces the launch of its second generation Bluetooth Smart platforms, designed to give greater flexibility to developers looking to create low-power wireless accessories. The CSR1010 and CSR1011, part of the CSR µEnergy range, will provide developers with end-to-end solutions for a range of devices, including HIDs such as wireless remote controls, mice and innovative ‘accessories’.
New Product Introduction From Rochester Electronics' Extension-of-Life Program
Rochester Electronics has re-introduced and continues to manufacture the Intel 82527 Serial Communications Controller for automotive applications. The highly integrated device performs all serial communication functions according to the CAN protocol such as transmission and reception of messages, message filtering, transmit search and interrupt search with minimal interaction from the host microcontroller, or CPU.
WD Designs First Enterprise-Class Hard Drives for Exploding Scale-Out Datacenter Market
WD today announced availability of its innovative WD Se line of hard drives, the first designed for scale-out datacenter deployments. Built on an enterprise-grade platform for reliable 24x7x365 datacenter operation, WD Se is tailored to deliver the right combination of performance, reliability and robustness for large-scale replicated environments, mid-sized network attached storage deployment, and backup/archiving applications.
Broadcom Announces Bluetooth Smart Chip
Broadcom today introduced a new Bluetooth Smart SoC to propel a broader range of low-cost, low-power peripherals to work with Android-based smartphones and tablets. The company also announced the contribution of its Bluetooth software stack, including classic Bluetooth and Bluetooth Smart (formerly Bluetooth Low Energy) technology, to the Android Open Source Project.
Industry’s Highest Performance Small Core x86 Server Processors
AMD unveil a new family of low power server processors: the AMD Opteron X-Series optimized for scale-out server architectures. The first AMD Opteron X-Series processors, formerly known as “Kyoto,” are the highest density, most power-efficient small core x86 processors ever built. The new X1150 and X2150 processors beat the top performing Intel Atom processor on key performance benchmarks, including single thread and throughput performance wit...
Supermicro Announces the Highest Density Server Solutions with Coming Intel Haswell Processors
Super Micro Computer today announced new compact high-density server solutions that will support Intel’s highly anticipated future Xeon Processor E3-1200 V3 product family. Supermicro uni-processor server solutions will bring to market higher performance with increased energy efficiency through improved system, cooling and power architectures and integration of Intel’s latest processor microarchitecture based on 22nm 3-D Tri-Gate technology.
DFI Annnounces CR902 COM Express Basic Type 2 QM77-based Module
DFI today announces a new Type of 2 COM Express basic form factor, the CR902-B, in its mobile Intel QM77 product line. This module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel Core/Celeron processor family, the next generation of 64-bit, multi-core processors built on 22/32-nanometer process technology delivering up to 15% CPU performance increase from previous generations.
B&B Electronics Announces Enhanced SNMP-Manageable Ethernet Media Converters
B&B Electronics Manufacturing Company today released its iMcV-Giga FiberLinX-III gigabit intelligent Ethernet media converter. This highly anticipated third generation of the company’s successful FiberLinX family is a 10/100/1000Mbps copper to 1000Mbps fiber device, converting existing copper wiring-based networks to fiber optics.
Verbatim V3 MAX USB 3.0 drives take data transfer speeds “to the max”
Verbatim expanded its popular and highly rated V3 Store’n’Go USB drive range with a product line offering faster connection and data transfer speeds. The V3 MAX delivers the fastest speed of any Verbatim USB drive. With USB 3.0 connectivity that is backwards compatible with USB 2.0 ports, the V3 Max has a very impressive read speed of up to 175MB/sec and a write speed of up to 80MB/sec.