Communications
Hirschmann Unveils Second Generation In-Car Entertainment Hub To Critical Acclaim, At AAITF.
Hirschmann Car Communication used the 2013 Automotive Aftermarket Industry and Tuning Fair, as a launch platform for its in-car Entertainment (ICE) Hub 2.0. Via an App, which is downloaded to a mobile device, the wireless multimedia box offers passengers the highest quality sound and picture quality, even at high speed.
Easy Bluetooth Smart app development with TI's SensorTag app for Android 4.3
Following the recent launch of Android 4.3 “Jelly Bean” with native support of Bluetooth Smart Ready, Texas Instruments unveil the Bluetooth Smart SensorTag app for Android. Available here for free , TI's new Bluetooth Smart SensorTag app removes entry barriers for app developers wanting to take advantage of the millions of Android smartphones and tablets that will soon be Bluetooth Smart Ready.
AMX unveil the Enova DVX All-In-One Presentation Switcher
AMX has unveiled its ninth and 10th model configurations of the award-winning Enova DVX All-In-One Presentation Switcher. The latest Enova DVX-3156HD models the DVX-3156HD-SP and DVX-3156HD-T which feature four built-in AMX DXLink distance transport inputs; two more than any other presentation switcher. These new models are ideally suited to support conference rooms and classrooms that require multiple distant connection points.
Lanner launch the LEC-7070 small form factor fanless embedded PC
Lanner Electronics launch the release of the new LEC-7070 small form factor fanless embedded PC, designed for use in digital signage or industrial automation. Featuring an on-board Intel® “Sandy Bridge” Celeron 807UE processor and including display outputs for both VGA and HDMI, the LEC-7070 is the successor to Lanner’s popular LEC-7050 and LEC-7020 models.
Peregrine and Taoglas partner on digitally tunable LTE antenna solution for M2M
Taoglas has teamed up with Peregrine Semiconductor to bring a dynamically tunable LTE antenna solution to the M2M market. The solution contains an embedded surface-mount ceramic PIFA antenna from Taoglas—the Warrior PA.710.A—and Peregrine’s successful PE64102 DuNE Digitally Tunable Capacitor on one evaluation board. It enables M2M devices to reach wide bandwidths and meet requirements for high performance using similar antenna s...
Samsung Exynos 5 Octa processor offers enhanced mobile graphics performance
Samsung introduce the latest addition to the Exynos product family with top level of graphic performance driven by a six-core ARM Mali-T628 GPU processor for the first time in the industry. With mobile use case scenarios becoming increasingly complex, Samsung's newest eight-core ARM Cortex application processor gives designers a powerful, energy efficient tool to build multifaceted user interface capabilities directly into the system architecture...
Samsung announce industry’s first PCIe SSD for Ultra-slim notebook PCs
Samsung reveal that it has begun mass producing the industry's first PCI-Express solid state drive for next-generation ultra-slim notebook PCs. The new Samsung XP941 delivers a level of performance that easily surpasses the speed limit of a SATA 6Gb/s interface. The Samsung XP941 enables a sequential read performance of 1,400MB/s, which is the highest performance available with a PCIe 2.0 interface.
Samsung announce high-performance SSD for enterprise servers and datacentres
Samsung has introduced a new solid state drive, the SM843T, for use in high-performance servers and storage in next-generation data centres, including Big Data systems. Offering up to 960 gigabytes of memory storage for faster and more efficient Big Data systems and cloud computing environments, the SM843T offers the industry's most advanced performance level for SATA 6.0 SSDs.
RealVNC delivers MirrorLink Certified product for in-car connectivity on Texas Instruments processors
RealVNC and Texas Instruments Incorporated have integrated remote access technology from RealVNC with the DRA64x and DRA65x automotive infotainment processors. The inclusion of VNC Automotive, a MirrorLink Certified product, delivers high quality in-vehicle entertainment and telematics capabilities to both drivers and passengers alike.
DFI launch the Type 2 COM Express basic module, the HR902-BL
DFI launches the HR902-BL, a Type 2 COM Express basic module, which in its product line based on the Mobile Intel HM65 Express chipset. This new module is powered by the BGA 1023 packaging technology for the low-power and cost-efficient 3rd/2nd generation Intel CoreTM processors with 22/32-nanometer process technology. It is a new COM Express form factor that supports the 3rd generation premium performance i7-3615/3612QE, i7-3555LE, i7-3517UE and...