Analysis
CitroËn Signs Up For EcoVelocity
Citroën was the first major car brand to sign up to appear at this year’s EcoVelocity motor show on September 8-11.
New Engineering Jobs Announced At Nissan Sunderland Plant
Nissan has launched a major new recruitment campaign for engineers and maintenance technicians to join its record-breaking Sunderland Plant.
Dedicated photovoltaic research system ordered in United States
RIBER, the global leader for molecular beam epitaxy (MBE), is announcing the sale of a Compact 21 MBE system to a US based major actor in the field of photovoltaic solar modules.
TDK-Lambda acquires plot of land adjacent to its European HQ - Ideal for TDK-Lambda’s future expansion plans
TDK-Lambda Managing Director Adam Rawicz said: “We have seen substantial growth over the last 2 years and the redevelopment of the site next door makes perfect sense, and will be an important part of our future expansion plans in Ilfracombe. We are achieving great success with our strategy of providing high reliability, class leading power supplies to manufacturers of professional electronic equipment. In particular, European customers are cont...
Nitto Denko develops novel optical touch-screen technology for “smart” stationery
Japan’s leading diversified materials manufacturer Nitto Denko Corporation has successfully developed a new concept of optical waveguide-based touch-screen technology. A proof-of-concept prototype made its debut at the 22nd International Stationery & Office Products Fair Tokyo (ISOT)* on 6th – 8th July, 2011.
FCI honours TTI, Inc. with Best European Growth Award
TTI, Inc., the global distributor of Passive, Interconnect, Relay & Switch and Discrete components, has been honoured with FCI’s award for ‘Best Growth’ in Europe in 2010. The world-leading connector manufacturer presented TTI, Inc. with the trophy at a ceremony held at the distributor’s European headquarters in Maisach-Gernlinden near Munich last month.
Cypress and UMC Deliver ICs On New 65-Nanometer SONOS Embedded Flash Technology
Cypress Semiconductor and United Microelectronics Corporation announced that they have produced working silicon on a new, 65-nanometer SONOS (Silicon Oxide Nitride Oxide Silicon) technology for embedded Flash memory. UMC will manufacture next-generation PSoC® programmable system-on-chip products for Cypress on the new process, along with nvSRAMs and other products. UMC will also make this technology available to other companies under a licensing...
NXP Consolidates No. 1 Position in Worldwide ID Market
NXP Semiconductors N.V. has announced that it has extended its lead in the global Identification market, after eight quarters of consecutive growth in total sales across all market segments using Identification technologies. With its focus on developing end-to-end solutions for security, convenience and connectivity, as well as its strategy of building entire ecosystems for ID applications, NXP is a clear leader in key segments including eGovernm...
STMicroelectronics and the BioRobotics Institute of Scuola Superiore Sant’Anna Establish a Joint Lab to Develop Advanced Robots and Smart Systems to Make a Difference in Life
STMicroelectronics and Scuola Superiore Sant’Anna of Pisa, a world center of excellence in advanced robotics and one of Italy’s most prestigious universities, have today announced the creation of a joint laboratory for research and innovation in bio-robotics, smart systems and microelectronics.
Laird Technologies to Attend APCO International 77th Annual Conference & Expo Company to Exhibit Public Safety Antenna Solutions
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the APCO International 77th Annual Conference & Expo. The event will take place at the Pennsylvania Convention Center in Philadelphia, Pennsylvania, August 7-10, 2011. Laird Technologies will exhibit at booth #1052.