Analysis
NI Releases iOS and Android Mobile Apps for NI Hardware and LabVIEW
National Instruments has announced NI LabVIEW software- and NI hardware-compatible mobile apps for iPhone, iPad and Android devices, helping engineers integrate the latest mobile technology into their applications. By combining the portability, ease of use, faster start-up time and longer battery longevity of mobile devices with the power of LabVIEW, engineers can more productively access measurement data from data acquisition and embedded monito...
Vicor to showcase high performance power components at PCIM Europe 2012
Vicor today announced its participation in the Power Conversion Intelligent Motion (PCIM) 2012 conference, the international conference on power electronics and its applications, hosted in Nuremberg, Germany, 8th -10th May, 2012. Vicor will highlight its full range of modular power components and innovative solutions for performance-critical applications at the event. Conference attendees can visit Vicor at stand 12-328 in the Nuremberg Exhibitio...
Fairchild Semiconductor and Infineon Technologies Reach License Agreement for Innovative Automotive MOSFET H-PSOF TO-Leadless Packaging Technology
Fairchild Semiconductor Corp and Infineon Technologies AG today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless (TO-LL) package (MO-299).
Fairchild Semiconductor to Showcase Industrial Power, Automotive, LED Lighting and DC-DC Conversion Solutions at PCIM Europe 2012
Fairchild Semiconductor will demonstrate innovative power solutions for real success at PCIM Europe 2012, 08-10 May, in Hall 12, booth 601, in Nuremberg, Germany.
ExCeL London Expands LED Lighting Retrofit Ahead of London 2012 Olympics with New Dialight Fixtures
In preparation to host the London 2012 Olympic Games, the award-winning ExCeL London International Exhibition & Convention Centre has expanded its efforts to convert the facility to greener, more energy-efficient LED lighting, replacing 35 existing 400W high-pressure sodium (HPS) fixtures with Dialight’s new 150W 14,000 lumen High Bay LEDs to better illuminate the north side exterior of the massive structure in the loading dock and traffic mars...
MAZeT Presents New JENCOLOR ICs for Photometry at the light+building 2012 Trade Show Hall 4.0, Stand F17
At this year's Light & Building 2012 trade show in Frankfurt am Main, Germany (hall 4.0, stand F17), MAZeT GmbH - development and production service provider for embedded computing solutions and optoelectronics located in the city of Jena - will unveil two new ICs for the target application of LED light control. The JENCOLOR MTCSiCF color sensor in its space-saving QFN16 housing (4 x 4 x 0.9 mm) provides colorimetry in accordance with the CIE1931...
Renesas Electronics Receives Above & Beyond Award From Delphi
Renesas Electronics received Delphi's 2011 Above & Beyond Award, one of its Pinnacle Family of Awards. The award was given in recognition of Renesas' service and support to Delphi following the earthquake in Japan in 2011.
Micrel Promotes Wiren Perera to Vice President, Corporate Strategic Marketing
Micrel, Inc. today announced that Wiren Perera has been promoted to Vice President of Corporate Strategic Marketing. Dr. Perera will focus on leveraging Micrel's unique complement of networking, communications and power management capabilities to drive the next stage of the company's growth. Additionally, he will continue to manage marketing and business development for the Ethernet business, comprised of a growing portfolio of LAN Solutions.
OpenET Alliance announces first members, releases updated interface specification
The OpenET Alliance has today announced its first wave of members, and the release of an updated interface specification for cellular terminals. The Alliance membership includes Altair Semiconductor, Anadigics, Huawei, Maxim, Nujira, Sony and the University of Florence.
P. D. Circuits Continues to Expand Its Engineering Team
P. D. Circuits, Inc. has added another new member to the team – Xiangdong Zeng, Product Engineering Technician. In his new role, Zeng will prepare complete and accurate data packages for assigned orders according to documented guidelines and SOPs. He will work with P. D. Circuits’ supply partners, customers and employees to coordinate the preparation of data packages for manufacturing.