Analysis
Cree Announces CFO Transition
Cree, Inc. today announced that John Kurtzweil has resigned as executive vice president-finance and chief financial officer, effective May 21, 2012, to pursue other opportunities, and that Michael McDevitt has been appointed CFO on an interim basis.
Huawei Announces Managed Services Agreement with Telefónica UK
Huawei today announced the signing of a five-year managed services agreement with Telefónica UK. Under the agreement, Huawei will be responsible for planning and managing Telefónica UK's core transmission, mobile access and network construction in the multivendor core network.
Huawei Receives Second TM Forum Solution Excellence Award
Huawei received the Solution Excellence award for Huawei's Value Growth Solution at the TM Forum in Dublin; marking the second time Huawei has received this honor. TM Forum's Solution Excellence Award is presented to suppliers or system integrators that demonstrate the most innovative and effective use of TM Forum Frameworx to deliver tangible cost reduction and efficiency improvement.
Huawei Launches End-to-End TDFi Solution at 2012 LTE World Summit
Huawei today launched an end-to-end TDFi solution at 2012 LTE World Summit. With TDFi, end users can access LTE TDD networks with any WiFi-enabled devices to enjoy high-speed mobile data services. The advent of mobile broadband has seen the demand for high-speed data services rapidly increase. But while LTE TDD commercialization has been steadily progressing, availability of compatible devices has been lagging.
STMicroelectronics and Soundchip Team to Revolutionize Sound Experience in the Ear
STMicroelectronics together with Soundchip SA today introduced technologies and components for the smart audio accessory – an exciting new concept in personal listening. Worn like a pair of In-Ear Monitors, the smart audio accessory features new means of controlling and personalizing the sound experience.
Cypress Developer Community Surpasses 50,000 Registered Users For PSoC Platform and Other Technologies
Cypress Semiconductor Corp. today announced that over 50,000 users have registered for the Cypress Developer Community, an online forum for sharing design tips, videos, and blogs on the company’s PSoC programmable system-on-chip platform and other technologies.
“20% annual growth to reach $5.4B in 2017!” announced Yole Développement
Yole Développement announces its report “MEMS for Cell Phones & Tablets”. “New MEMS devices will benefit from the mobile device growth that is predicted for the coming years: phones and tablet will represent a 2.9B units in 2017 and most of them will integrate 5 to 10 MEMS devices”, announces Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies, Yole Développement.
Wireless innovation under debate at Future of Wireless International Conference
The ‘Cambridge Debate’ at this year’s Future of Wireless International Conference, will present the motion that the future of innovation in the wireless industry is in the virtual rather than the physical world. At the debate, which is hosted by BBC News correspondent Peter Day, Ray Anderson, CEO at Bango will speak for the motion while David Wood, Chief Technology Architect from Accenture Mobility will argue against, before the question is...
Power protection with the Olympics in mind
With the London 2012 Olympic Games now only two months away, data centre operators are being advised to prepare for the significant increase in power consumption across the capital, as well as any conceivable disruptions occurring during the competitions' six weeks schedule.
Texas Instruments Drives Adoption of Copper Wire Bonding Technology, Delivering Nearly 6.5 Billion Units to Customers
Texas Instruments Incorporated today announced it has shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products. This milestone underscores TI’s confidence in copper as a viable replacement to gold in its semiconductor product roadmaps, and the electronics industry’s acceptance of the technology, due to performance, quality and reliability benefits for a range of applications.