Memory
Improved performance with high-speed CMOS DDR4 SDRAMs
Alliance Memory has announced that it has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4Gb AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.
SDRAMs combine low power consumption with faster data transfer
A line of high-speed CMOS DDR4 SDRAMs has been released by Alliance Memory. For improved performance over previous-generation DDR3 devices, the 4Gb AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.
Collaboration to expand xSPI ecosystem for emerging IoT devices
Adesto Technologies and Cadence Design Systems have announced they have collaborated to expand the ecosystem around the Expanded Serial Peripheral Interface (xSPI) communication protocol to enable higher transfer rates and lower latency for flash memory in internet of things (IoT) devices.
NOR flash memories provide 55ns access times
A new line of 5V parallel NOR Flash memory products in boot and uniform sectored architectures has been introduced by Alliance Memory. Available in densities from 1M to 16M, the devices offer access times of 55ns to enable fast, low-latency read speeds, allowing for both direct code execution and data storage in a single memory product.
File system solution for failsafe data storage
HCC Embedded (HCC) has introduced SafeexFAT, its failsafe, RTOS-independent exFAT file system implementation that provides an easy integration for device manufacturers who demand the utmost in storage reliability for their deeply embedded applications. This is particularly important for manufacturers of devices where loss of data could be detrimental, such as in automotive, industrial, and medical applications.
Hard drive series deliver expansive storage for NAS applications
Toshiba Electronics Europe has announced the addition of new 16TB helium-sealed models to both the N300 NAS Hard Drive and X300 Performance Hard Drive Series. The 16TB models offer 14% more capacity than 14TB models. The 16TB models also double the buffer size of the 14TB models, increasing from 256MiB to 512MiB.
The next logical step for industrial-grade storage
The era of intelligent IoT is just around the corner. As 3D NAND Flash memory cements itself as a core part of this technology suite, PCIe and NVMe are becoming dominant due to their rapid, reliable transmission speeds. SSDs with these ports are rapidly going mainstream.
DRAM memory product assortment expanded
Distrelec has rapidly expanded its range of memory IC’s with Alliance Memory. Alliance Memory manufactures memory products that are pin for pin drop-in replacements for brands such as Micron, Samsung and Hynix. The brand’s product portfolio includes a full range of 3.3 and 5V asynchronous SRAMs used with mainstream digital signal processors (DSPs).
UltraScale+ high memory bandwidth MPSoC module
With the Mercury+ XU9 MPSoC module, FPGA specialist Enclustra presents the sixth SOM family based on the Zynq UltraScale+ MPSoC from Xilinx. To achieve the highest possible memory bandwidth, it is equipped with two memory banks: a 64-bit wide DDR4 SDRAM (up to 4 GBytes) connected to the PL and a 72-bit DDR4 ECC SDRAM (up to 8 GBytes) connected to the PS. Thus, the module achieves a memory bandwidth of up to 38.4 GByte/sec.
NVMe-oF Ethernet SSD technology leadership extended
Marvell has announced an expansion of its NVMe over Fabrics (NVMe-oF) portfolio. The solutions include one powering the Toshiba Memory native NVMe-oF Ethernet solid state drive (SSD) with Marvell’s NVMe-oF SSD converter controller, delivering direct-to-Ethernet SSD.