MOSIS teams up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS' customers access to imec’s state-of-the-art fully integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology.

Cortus silicon efficient 32-bit processor IP and MOSIS announced the signing of a sales representative agreement. Under the agreement, MOSIS will offer the Cortus APS3R and associated peripherals to their customers. The deal will support the licensing of Cortus IP from design through prototyping to volume production with MOSIS.

The MOSIS Service, a leading provider of semiconductor fabrication solutions, today announced that it has expanded its relationship with IBM to now include silicon-on-insulator (SOI) technology at multiple advanced lithography nodes. MOSIS is offering IBM’s 45-nm SOI technology on 300mm wafers and IBM's 180-nm SOI technology on 200mm wafers. MOSIS customers now have a low-cost route to prototyping and low-volume production with leading-edge S...

MOSIS has announced that it will commence multi-project wafer (MPW) runs using IBM’s new 0.18um high voltage process. The technology meets the growing demand for ICs to provide a high voltage capability in low power hand-held products. Typical applications include power management ICs for portable devices such as PDAs and cellphones as well as low cost integrated controllers for automotive, medical and industrial designs.