Versatile heat sinks suit space-limited designs

VersarienCu reduces the potential size requirement of individual components due to increased thermal efficiency. Where space has traditionally been at a premium, the metallic foam now allows for a reduced footprint. The increased thermal efficiency of the copper foam on the component can allow for a cooling fan to be removed from products, and has the additional major benefit of increasing the life of a component by reducing overheating.

By producing a standard range of off-the-shelf products Versarien will be able to offer this advanced cooling technology to customers at a more competitive price which, together with the improved thermal management capabilities has already resulted in significant interest from large scale users, who are looking for more reliability and functionality for their electronic components.

Neill Ricketts, CEO, Versarien, said “This is an important development for Versarien and fits with our stated strategy of providing both standard and customised products to the market. With the introduction of these standardised products into our range, in conjunction with our recent acquisition of Custom Systems, we are able to offer both new and existing Custom Systems customers a cost effective solution to their thermal management needs.”