DEK Maintains its Promise of “Expect More” Technology Showcase to be Unveiled at NEPCON CHINA 2012

23rd April 2012
News Release from: ASM Assembly systems
Written by : ES Admin
DEK will launch ProDEK in Asia as part of its showcase of advanced print platforms, productivity tools and process improvement products at NEPCON China 2012. NEPCON China 2012 will be held at the World Expo Convention & Exhibition Centre in Shanghai from 25 April to 27 April, 2012.
DEK’s General Manager for Greater China, Mr. Allen Huang said: “We are committed to innovation and the continuous development of leading advanced products to meet the sophisticated needs of our customers. Therefore we are proud to be showcasing some of our most innovative technology at NEPCON China 2012 so that visitors can experience our results first hand.”

DEK’s highlight at NEPCON China 2012 will be the Asia launch of ProDEK, an innovative and high performance closed loop system tool designed to optimise printing performance. Already recognised as the most robust and repeatable print technology available, ProDEK communicates between the DEK screen printer and solder paste inspection machine to identify any potential problems, effectively maintaining consistent and repeatable high quality output levels to the most demanding of tolerance parameters. At every stage of assembly, the closed loop system helps to control the variable factors that can have an adverse effect on the process. However, the most significant impact to the entire assembly process is at the print stage. ProDEK’s proactive defect prevention capability offers assemblers significant optimised performance, higher yield, increased throughput and substantial reduction in consumable usage – eliminating the possibility of human error, through real time automatic correction.

Along with ProDEK, DEK will also showcase its breakthrough stencil coating technology – Nano-ProTek. It delivers high performance stencils in a cost-effective wipe to overcome the challenges of smaller aperture sizes. Easy-to-apply, the technology is based on a unique proprietary formula that renders the entire stencil surface “fluxophobic”.

In addition to Nano-ProTek, the EzClean Fabric Roll and Pro XF will be showcased. EzClean Fabric Roll is a stencil cleaning fabric roll specially designed for efficient under-stencil cleaning process by evenly distributing the cleaning agent for a more productive clean. Pro XF is an under-stencil cleaning agent that improves process performance and reduces the risk of print defects. Cleaner and more environmentally friendly than IPA and traditional solvent cleaners Pro XF is also safer to use, store and transport, enhancing the process even further.

The Horizon iX Series printing platform will also be displayed during the exhibition, including the best-in-class performance platform Horizon 03iX, which won several awards last year and Horizon DL RTC.

Other equipment and tool highlights at NEPCON China 2012 will include: the breakthrough product ProActiv, which enables next generation components to be printed alongside standard components using only a conventional printing process with a single thickness stencil; and HawkEye Bridging, which boasts automatic print verification technology, all delivering on DEK’s ‘Expect More’ philosophy.

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