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MOSIS to offer multi-project wafer services for IBM’s 0.180um high voltage process

6th May 2009

MOSIS Integrated Circuit Fabrication Service

ES Admin

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MOSIS has announced that it will commence multi-project wafer (MPW) runs using IBM’s new 0.18um high voltage process. The technology meets the growing demand for ICs to provide a high voltage capability in low power hand-held products. Typical applications include power management ICs for portable devices such as PDAs and cellphones as well as low cost integrated controllers for automotive, medical and industrial designs.

MPW runs are ideal for organizations wishing to quickly trial a design without incurring the high costs of a fully engineered process run. The service, suited to large companies as well as new start-ups, is ideal for the prototyping of innovative and complex designs. Using the MPW service, users can access expensive wafer fabrication runs at a fraction of the normal cost, by sharing the production costs across many users.

PDK support is available for various design flows, including Cadence, Mentor, Synopsys and Tanner tools. In addition, IBM provide an extensive library of I/O and standard cells.

The 0.18um process combines IBM’s expertise in CMOS and austriamicrosystems proprietary high voltage technology and is the outcome of a development agreement signed in early 2008.

The CMOS7HV process is a terrific addition to IBM's already strong 180nm process technology roadmap states Wes Hansford, Deputy Director of MOSIS Service. This best-in-class 180nm High-Voltage CMOS technology will truly benefit our customers looking to produce cost effective, high performing mixed signal designs capable of handling higher voltages.