Analysis

Book highlights top tips for embedded projects

8th March 2017
Mick Elliott
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Following on from the success of its initial ‘Essential Design Tips for Engineers’ book, Premier Farnell has developed a second book focussing purely on Embedded Design. With the embedded space still seeing rapid expansion, the demands on single board computing functionality is also rising. 

In recognition of this, AVID and Embest, as part of the Premier Farnell group, are harnessing the power of their exclusive agreements with manufacturers to offer a customisation service for industrial and commercial applications.

Premier Farnell worked with Hilscher Gesellschaft für Systemautomation in Germany to combine the Raspberry Pi with Hilscher’s network chip netX on a customised form factor to create an Edge Gateway suitable for the industrial environment.

This project demonstrates the success of working with one company throughout the design and production phases. Premier Farnell offered the flexibility to create a bespoke solution which was also more cost effective than designing a board from scratch. 

The company has extensive experience working with start-ups through to the largest semiconductor manufacturers and can therefore provide full design support, especially when the project has potentially complex demands.

The latest book in the design tips series provides design engineers with project advice from an engineer’s perspective, reflecting the unique challenges faced by designers when working with embedded applications. Many members of the Premier Farnell team are engineers and are ideally placed to understand the information and resources that fellow designers need.

Premier Farnell is now asking for input on their next design tips book, focussed on design tips for makers.

Premier Farnell and the element14 community are asking makers across the globe to contribute tips to be included in the book. 

Anyone interested in submitting their own design tip should visit the element14 community.

Farnell element 14 will have copiea of the book on its stand at Embedded World 2017 in Nuremberg (March 14-16).

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