Analysis
STI Electronics’ Mel Parrish to Chair the Product Assurance Planning Meeting at APEX 2012
STI Electronics, Inc. announces that Mel Parrish, FSO/Director of Training Materials, will chair the Technical Activities Executive Committee (TAEC) meeting at the upcoming IPC APEX EXPO, scheduled to take place Feb 28-March 1, 2012 at the San Diego Convention Center in San Diego, CA. The Product Assurance committee will take place during the Management Session of the Standards Development Meetings on Monday, February 27, 2012 from 8-9 a.m.
Servo research points the way to improved dynamics
Research at the University of Manchester has demonstrated servo systems with vastly improved dynamics with the most challenging of loads. The key to the increased performance is a torque transducer from Sensor Technology employing Surface Acoustic Wave (SAW) techniques to deliver high-bandwidth, non-contact solution.
Aegis iLaunch software optimizes Sigma Technologies’ NPI process
Sigma recently purchased iLaunch software from Aegis after identifying that their NPI process would greatly benefit from improved speed, accuracy and control. Their review of offerings from Aegis Software and competing suppliers had indicated that only Aegis could deliver the speed of conversion and control of processes that they sought.
Altium releases new range of board-level components in collaboration with STMicroelectronics
Altium announces the addition of a comprehensive new range of board-level components from STMicroelectronics' Power Management catalogue to its online content delivery ecosystem, AltiumLive. The announcement heralds further expansion of Altium's partnership program, which aims to forge collaborative relationships with a broad group of electronic component manufacturers and distributors.
Yamaha Standardizes on Synopsys' Processor Designer after Cutting DSP Development Time in Half
Synopsys, Inc. today announced that Yamaha has adopted the Synopsys Processor Designer tool for the development of its custom-designed digital signal processing (DSP) devices. Using the Processor Designer tool to automate the design and implementation of its XMP-1 DSP, Yamaha doubled the number of sound channels for their high definition sound generator device and taped out six months, or 50 percent, earlier compared to their previous generation ...
Bentek Solar Announces 25 MW UTS Solar Product Supply Agreement with Signal Energy
Bentek Solar announces a 25 MW supply agreement with Signal Energy, a major UTS, design/build general contractor for the North American renewable energy industry. Bentek Solar will supply Signal Energy with UTS combiners, re-combiners, disconnect safety systems and accessories for 25 MW of solar projects in the Southwestern United States.
SEMA and SMTA Solar Manufacturing and Reliability Conference Program Announced
SEMA and SMTA announce the finalized program for the Solar Manufacturing & Reliability Conference, which will take place from March 22-23, 2012 at the Fairmont Hotel in San Jose, CA. The program will consist of presentations and discussions focusing on the reliability testing of PV modules, covering gaps and where future work needs to be done.
CommAgility first to ship AMC boards with highest speed Texas Instruments DSPs
CommAgility announced today that its AMC-2C6678 and AMC-2C6670 DSP boards are now shipping with the fastest versions of the high-performance TMS320C6678 and TMS320C6670 digital signal processors (DSPs) from Texas Instruments Incorporated (TI).
Coverity Announces Formation of Security Research Laboratory
Coverity today announced the formation of the Coverity Security Research Laboratory (SRL) as part of the Office of the Chief Technology Officer (CTO). The Coverity SRL will remain on the cutting edge of security vulnerability research, investigating and uncovering the root cause of new and existing vulnerability-causing defects that exist in software code. This knowledge will be built into the Coverity technology portfolio to better enable organi...
Imec and Genalyte report disposable silicon photonics biosensor chips
Imec and Genalyte announce that they have successfully developed and produced a set of disposable silicon photonics biosensor chips to be used in Genalyte diagnostic and molecular detection equipment. The chips combine imec’s standard silicon photonic waveguide devices with bio-compatible modifications jointly developed by imec and Genalyte. These chips allow for high levels of multiplexed biosensing due to the high integration level of Si phot...