Analysis
Maxim To Demonstrate Highly Integrated Solutions for Embedded Designs at EMBEDDED WORLD Exhibition & Conference 2012
Maxim Integrated Products, Inc. will offer a rich choice of design ideas for embedded applications at the upcoming Embedded World Exhibition & Conference 2012 in Nuremberg/Germany (February 28 – March 1). With its expertise in providing highly integrated analog and mixed-signal products as well as full-featured reference designs, Maxim offers solutions for a wealth of embedded applications and helps designers speed up time-to-market.
Imec and Holst Centre present 14 key achievements at International Solid-State Circuits Conference
At next week’s International Solid-State Circuits Conference (February 19-23, 2012, San Francisco, USA), imec and Holst Centre present 14 papers on low power design for wireless communication and wireless sensor networks, and organic electronics. Over the week, imec and Holst Centre will issue several news releases showcasing recent important breakthroughs in these different research domains.
LDRA Opens Division Dedicated to Comprehensive Certification Services
LDRA has created LDRA Certification Services (LCS), a division devoted to helping customers develop certification-ready products. The LCS team includes Federal Aviation Administration (FAA) Designated Engineering Representatives (DER) and safety engineering experts, who offer product certification solutions at a fixed price. They are able to offer this client-centered, risk-free approach, based on their vast experience.
Pickering Interfaces on Course for Expansion
Pickering Interfaces GmbH has reorganised its sales region for Eastern Europe. The sales office, located in Třinec/CZ, which supported the Czech Republic, the Slovak Republic and Poland, will expand its sales region to support Romania, Hungary, the Republic of Slovenia, Bosnia and Herzegovina and the Republic of Serbia.
Mouser Now Stocking Panasonic Semiconductors Through Hole LEDs
Mouser Electronics, Inc announced it is stocking new product from Panasonic Semiconductors.
The function of functional safety: IEC 61508 for industrial and ISO 26262 for automotive
By Aaron McDonald – Recently, I participated in a functional safety training session on failure modes, effects and diagnostic analysis calculations. While this is important information, it is difficult to make it overly exciting. To kick off the discussion, the presenter pulled out a match and called it a “safety match,” the type that can only be lit against the special material on the side of the match box. Next, he pulled out ...
Lattice features new products and technologies for embedded design applications
Lattice Semiconductor Corporation today announced its plans for Embedded World 2012, which will take place Feb 28th – March 1st in Nuremberg, Germany. Lattice will be exhibiting in Hall 5, Stand 142, and will be featuring among other things its recently announced LatticeECP4TM family of devices.
Lattice features latest mobile FPGA platforms at Mobile World Congress
Lattice Semiconductor Corporation today announced it will exhibit at Mobile World Congress, Feb 27th – March 1st at Fira de Barcelona in Barcelona, Spain. Lattice will be located in Hall 2.1, Stand 2.1A56, and will be featuring the company’s mobileFPGA™ platforms including the new iCE40™ and MachXO2™ FPGAs and ispMACH® 4000ZE CPLDs.
Free Keithley Web-Based Seminar Explores Source Measurement Instrumentation
Keithley Instruments, Inc. will broadcast a free, web-based seminar titled “What is an SMU Instrument, and How Do You Decide Which One is Right for Your Application?” on Thursday, February 23, for participants in North America and on Thursday, March 1, for those in Europe. This one-hour seminar will address how source measurement unit (SMU) instruments work, describe key features and capabilities to consider when selecting them, and compare t...
Nihon Superior’s Keith Sweatman to Present at TMS Annual Conference
Nihon Superior Co. Ltd. announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference, scheduled to take place March 11-15, 2012 at Walt Disney World Swan and Dolphin Resort in Florida.