Wireless Microsite

Molex produces 20 Millionth 3D Antenna using LDS Technology

23rd July 2009
ES Admin
0

Molex has produced its 20 millionth 3D antenna using LDS technology, since it started production last summer. Laser Direct Structuring (LDS) technology offers flexibility and geometric 3D design freedom in making antenna products over conventional flex-antenna technologies.

Previously used flex-antenna technologies only allow a maximum 2.5D design of the antenna radiator. Using a 3D laser system, LDS technology allows the transfer of the antenna design from CAD data onto a moulded antenna carrier or even directly onto the device structure, such as a mobile phone cover. Cosmetic surfaces of the antenna also can be achieved by using a subsequent spray painting process.



“LDS technology surpasses the physical and economic limits of conventional antenna manufacturing technologies such as flex or stamped metal,” said Ellen Maassen, antenna business unit director, Molex Incorporated. “We predict that LDS will be the standard chosen antenna technology in the years to come. The entire production process – from moulding to laser structuring and plastic plating – is located in one facility. Our all under one roof approach enables the highest level of quality for our LDS products. We have steadily increased our LDS capacity in the last 12 months and are adding additional capacity as we see more and more LDS applications.”



For many years, Molex has been a leader in two-shot antennas. With LDS, Molex will further advance its leadership in 3D antennas, especially as both technologies can be combined.



LDS technology uses a laser beam that creates the antenna pattern on the surface of complex 3D parts moulded from an LDS resin. Key advantages of the technology include greater flexibility for fast design changes and the possibility of creating antenna structures on a 3D surface. LDS technology also allows customers a higher level of product integration with fewer components and lower costs. For example, multiple antennas can be directly integrated into the mechanical structure of a bigger device. Molex therefore also offers a variety of subassembly services ranging from mechanical assembly to SMT, providing a fully vertically integrated product.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier