Test & Measurement

CyberOptics to Showcase Its Latest Inspection Solutions at NEPCON Thailand 2011

15th June 2011
ES Admin
0

CyberOptics announced that it will feature its multiple award-winning QX500 AOI system and robust SE350™ in-line SPI system at the upcoming NEPCON Thailand, scheduled to take place June 23-26, 2011 at the Bangkok International Trade & Exhibition Centre (BITEC) in Bangkok. CyberOptics’ representative in Thailand and partner for the show, WKK, invites all attendees to visit Booth B501 for a firsthand demonstration of CyberOptics’ latest inspection systems.

CyberOptics’ innovative QX500™ AOI system is designed with a unique image acquisition solution ― Strobed Inspection Module (SIM) ― bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false call rate.

The introduction of strobed white lighting in the QX500™ makes it the only AOI system to provide ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec, setting it apart from other conventional AOI systems. The QX500™’s dual fixed-angle lighting provides superb image quality for advanced automated inspection of solder and lead defects, presence and position, correct part and polarity for inspection down to 01005 components.

SE350™ is the latest addition to CyberOptics’ 3-D solder paste inspection system portfolio. The simple and robust SE350™ is equipped with CyberOptics’ calibration-free 3D sensor technology to inspect even the most demanding assemblies. The sensor is an integrated assembly designed with no moving parts, eliminating machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry. Leveraging on development efforts of the SE500™, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm).

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