It has been announced that Laird Thermal Systems has expanded its Peltier thermoelectric module product family with the HiTemp ET Series, designed to protect critical electronic devices like CMOS sensors in high temperature applications. Recent advances in CMOS sensor technology have made these sensors practical and effective for use in a wide range of imaging applications.
These sensitive CMOS sensors convert photons to electrons for digital processing. Thermal noise causes CMOS sensors to lose image resolution as temperature increases. This can occur in many outdoor applications, where heat generated by surrounding electronics exceeds the maximum operating temperature of the CMOS sensor. To prevent image quality from deteriorating, high temperature Peltier coolers can reduce the sensor’s temperature, maintaining acceptable noise levels.
Laird Thermal Systems’ HiTemp ET Series thermoelectric modules deliver spot cooling to ensure optimum CMOS sensor performance. The HiTemp ET Series is a preferred cooling solution in CMOS sensor applications and has proven not to degrade in high heat environments. To meet a broad range of design requirements, the HiTemp ET Series includes 53 models offering a variety of heat pumping capacities, geometric form factors and input voltages.
Laird Thermal Systems’ enhanced Peltier module construction prevents copper diffusion and degradation in performance, which can occur in standard grade thermoelectric modules in higher temperature environments. The HiTemp ET Series construction does not sacrifice performance for reliability like other high thermoelectric modules on the market. It maintains a high coefficient of performance (COP) allowing for maximum heat removal into the air.
“As CMOS sensors are incorporated into new emerging applications for outdoor environments, thermal management becomes more important to keep sensors below their maximum operating temperature limit,” said Andrew Dereka, Product Director at Laird Thermal Systems. “Spot cooling that features a thermoelectric module provides an active cooling solution that allows these critical sensors to maintain maximum image resolution for their application.”
Offering active cooling for applications operating in temperatures ranging from 80 to 150°C, the HiTemp ET Series offers a cooling capacity of more than 300W in a compact form factor. The HiTemp ET Series is designed for higher current and larger heat-pumping applications offering precise temperature control accuracy achieving ±0.01°C.