OIS/AF driver enhances energy efficiency

The driver integrates a DSP core with multiple analogue peripherals for image stabilisation, auto-focus control, and H-bridge and constant-current drivers.

The addition of on-chip Flash memory provides storage for the DSP program and calibration parameters, thus saving 90% of the overhead time needed to load from conventional memory on startup.

This highly integrated solution enables faster implementation of OIS and AF functionality into camera modules while remaining compatible with a wide array of image sensors. Furthermore, the high level of functional integration supports the need for very thin camera modules. 

"There is growing demand for enhanced image clarity and quality in the latest smartphone models, as on-the-go consumers expect to derive better and better user experiences regardless of device size,” said Tomofumi Watanabe, business unit Leader of the Power Solutions Products in Intelligent Power Solution Division at ON Semiconductor. “The LC898123AXD enables camera module designers to meet these ever demanding requirements”.   

The driver has lower current consumption, enabling improved battery lifetime. The DSP performance and flexibility allows support for various VCM actuators.

The high-performance 32-bit DSP optimised for OIS/AF signal processing covers many functions, such as servo control, gyro data filtering, and host command interface.  

In addition, the LC898123 offers “High Level Command” function to standardise commands from the main CPU to the camera module, enabling phone developers to use standardised commands for multiple camera modules/actuators without changing CPU software. 

Reference designs dedicated to Camera Module Integrators are available, accelerating the OIS/AF evaluation as well as reduce the development workload.