At this year’s MEMS Executive Congress Europe, Bosch will showcase its latest MEMS solutions, including a triaxial acceleration sensor and an integrated MCU for Android. Presented by the MEMS Industry Group, the MEMS Executive Congress Europe 2015 brings together leaders from the field of MEMS and sensors. The event takes place on 9th and 10th March in Copenhagen, Denmark.
Bosch's triaxial acceleration sensor, SMA130, was designed for automotive applications, but is based on a sensor and packaging technology that was initially designed for the consumer electronics market. With its size of just 2x2mm it is world’s smallest automotive acceleration sensor, enabling convenient integration into a vehicle.
Bosch Sensortec has combined the decades of company-wide experience in both MEMS and electronics design to deliver its sensors with integrated MCU for Android smart phones. These sensor hubs significantly reduce power consumption for always-on sensor applications such as fitness tracking, indoor navigation and gesture recognition.
In the MEMS Executive Conference's opening keynote, Dr Franz Laermer, Vice President, Corporate Sector Research and Advanced Engineering, Microsystems Technologies, Bosch, will speak about the Deep Reactive Ion Etching (DRIE) Process that he invented more than 20 years ago alongside Andrea Urban. Now widely known as the ‘Bosch Process’, this key microfabrication technology was one of the most important enablers for the fabrication of all silicon-based MEMS devices.