Sensors

A new 0-360° angle sensor ICs has ultra-fast response time

8th November 2017
Anna Flockett
0
Datasheets

The A1333 and A1339 are the two new 0° to 360° angle sensor ICs from Allegro MicroSystems Europe that have ultra-fast 15µs response time and support 10MHz SPI and real-time ABI and UVW outputs for fast data transmission. They also provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology. 

Allegro’s A1333 and A1339 devices include a system-on-chip (SoC) architecture that includes: a CVH front end, digital signal processing, and supports multiple digital output formats, including Allegro’s first motor commutation outputs (UVW), and encoder outputs (A, B, I) for angle sensor ICs that can operate at either 3.3 or 5V.  

The A1333 and A1339 are offered in both single and dual die versions for systems that require redundant sensors. They both include on-chip EEPROM technology, capable of supporting up to 100 read/write cycles, for flexible end-of-line programming of calibration parameters.

Both devices are suitable for automotive applications requiring 0° to 360° angle measurements, such as motor position measurements for steering and braking systems and other high speed actuators for pumps and transmissions that require low latency and high resolution.

The A1339 also includes an integrated turns counter and low power mode features that enable it to track changes in the target magnetic field in automotive applications even when the vehicle is in the ‘key off’ state.

Both the single and the dual die A1333 and A1339 devices were designed in accordance with ISO26262:2011 requirements for hardware development (pending assessment).

The single die versions were targeted to meet ASIL B requirements and the dual die products were designed to meet ASIL D requirements when integrated and used in conjunction with the appropriate system level control.

The stacked die nature of the dual die assembly provides better channel to channel matching than more traditional side by side assembly techniques. This is a key parameter for safety critical applications where the output of the two sensors is compared to insure that the system is operating safely.

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