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The DRV8263H-Q1 evaluation module (EVM) showcases the features and performance of the DRV8263H HotRod package. The DRV8263H-Q1 is a fully integrated half-bridge driver intended for a wide range of automotive applications.

The TPSM265R1 is a compact, easy-to-use module that operates over a wide input voltage range up to a maximum continuous input voltage of 65 V. The module fully integrates a controller, MOSFETs, and an output inductor.

The TPSM8282x device family consists of a 1-A, 2-A, and 3-A step-down converter MicroSiP power modules optimized for small solution size and high efficiency. The power modules integrate a synchronous step-down converter and an inductor to simplify design, reduce external components and save PCB area.

TPS1HTC30-Q1 is a single-channel, smart high-side switch, with integrated NMOS power FET and charge pump, designed to meet the requirements of 24-V automotive battery systems.

The SimpleLink Wi-Fi CC32XX SDK contains drivers for the CC3220 and CC3235 programmable MCU and documentation needed to use the solution. It also contains the flash programmer, a command line tool for flashing software, configuring network and software parameters (SSID, access point channel, network profile, etc.), system files, and user files (certificates, web pages, etc).

The xWRL6432AOPEVM is an easy-to-use, low cost FR4-based evaluation board for the xWRL6432AOP mmWave sensing device, with standalone operation and direct connectivity to the DCA1000EVM for raw ADC capture and signal processing development. This EVM contains everything required to start developing software for on-chip hardware accelerator and low power ARM Cortex M4F processor.

The LMR38020-Q1 synchronous buck converter is designed to regulate over a wide input voltage range, minimizing the need for external surge suppression components. The LMR38020-Q1 operates during input voltage dips as low as 4.2V, at nearly 100% duty cycle if needed, making the device an excellent choice for 48-V battery automotive applications and MHEV/EV systems.

The RES60A-Q1 is a matched resistive divider, implemented in thin-film SiCr with Texas Instruments’ modern, high-performance, analog wafer process. A high quality SiO2 insulative layer encapsulates the resistors and enables usage at extremely high voltages, up to 1400VDC for sustained operation or 4000VDC for HiPOT testing (60s).

At embedded world 2025, Electronic Specifier's Managing Editor, Paige West, talks to Marian Kost Vice President and General Manager - Connectivity at Texas Instruments about the building blocks TI offer for IoT.

At embedded world 2025, on the DigiKey booth, Caitlin Gittins speaks with Artem Aginskiy, General Manager, General Microprocessors, Texas Instruments about TI’s product portfolio and how it's thinking about scalability and reusability.