Search results for "chiplet"

Three Fraunhofer Institutes have launched aforward-looking researchinitiative in Dresden: the Chiplet Center of Excellence (CCoE).

ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

Start-up Baya Systems has emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and multi-die SoC designs.

Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet built on Arm Neoverse Compute Subsystems (CSS) for AI/ML, high-performance compute (HPC), data centre and 5G/6G networking infrastructure applications.

Cadence Design Systems, Inc. has unveiled a new partnership with Arm, aimed at fostering software-defined vehicle (SDV) innovation.

Adeia have announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on 6th to 8th February 2024, at the Santa Clara Convention Centre.

Empower Semiconductor, a specialist in integrated voltage regulators (IVRs), is set to present a technical paper at the forthcomingChiplet Summit, scheduled at the Santa Clara Convention Centre from 6-8thFebruary 2024.

Menta will attend Chiplet Summit to present MOSAICS-LP – an industrial platform specifically designed for the development of heterogeneous chips, using a universal chassis and a catalogue of third-party chiplets.

Socionext has announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and Edge-of-network markets.