Search results for "Rohm"

ROHM has developed the new four-in-one and six-in-one SiC moulded modules in the HSDIP20 package optimised for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).

From 6-8th May, ROHM will exhibit at the PCIM Expo & Conference in Nuremberg. On its booth, ROHM will showcase reference projects with renowned partners and present the evolution of its package designs and evaluation boards.

ROHM has developed N-channel power MOSFETs featuring low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers.

Mazda and ROHM have commenced a joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.

ROHM has developed a new thermal printhead –KA2008-B07N70A– compatible with a two-cell Li-ion battery (7.2V). It is designed to deliver high print quality with low power consumption.

ROHM has developed 650V GaN HEMTs in the TOLL (TO-LeadLess) package: the GNP2070TD-Z. Featuring a compact design with excellent heat dissipation, high current capacity, and switching performance, the TOLL package is increasingly being adopted in applications that require high power handling, particularly inside industrial equipment and automotive systems.

ROHM has expanded its portfolio of general-purpose chip resistors with the MCRx family, designed to achieve greater miniaturisation and enhanced performance across a wide range of applications.

ROHM has begun offering samples of the industry’s smallest* terahertz (THz) wave oscillation and detection devices utilising semiconductor elements known as Resonant Tunneling Diodes (RTDs).

ROHM has developed a high output laser diode –RLD8BQAB3– for use in ADAS (Advanced Driver Assistance Systems) equipped with LiDAR for distance measurement and spatial recognition.

ROHM Semiconductor Europe is looking forward toelectronica 2024– the trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between 12-15thNovember in Munich.