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Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It provides an easy dispensing profile with an exceptionally long working life at room temperature, making it well suited for streamlining automated assembly.

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices.

Master Bond has launched EP53TC, a two-component expoy designed for bonding, sealing, coating, and small potting applications efficient heat dissipation is essential.

Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003”, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2using a UV light source emitting at a wavelength of 320-365nm.

Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency.

Master Bondand STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporised Hydrogen Peroxide (VHPTM) using V-PRO s2 Low Temperature Sterilisation System.

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals.

Master Bond Supreme 11AOHTLP is atwo component epoxyfeaturing thermal conductivity and electrical insulation.

Master Bond UV15DC80-1Med presents a unique dual-cure mechanism, combining UV light for initial setting with heat for full polymerisation.