Search results for "Master Bond"

Henkel has added a new module to its free LOCTITE XPLORE e-learning platform – Rebuilding OEM Seams. Tailored specifically for professionals in the automotive repair and bodyshop industries, this marks the third LOCTITE XPLORE module dedicated tothe automotive sector.

Henkel has added a new module to its free LOCTITE XPLORE e-learning platform - Rebuilding OEM Seams.

At the 2025 EDS Leadership Summit in Las Vegas, Paige West, Managing Editor of Procurement Pro, caught up with Cristian Stanciu, Vice President of Sales at Master Electronics, to discussthe company’s evolvingstrategy, digital transformation, and outlook for the year ahead.

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for underfill, coating, impregnating, and porosity sealing applications.

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special colour changing feature.

ASMPT has introduced its latest high-performance wire bonder: the AERO PRO. Engineered for high-density semiconductor designs, the AERO PRO offers the highest bonding accuracy and speed for wires with diameters of 0.5 mil.

It would be fair to say that present day IO-Link sensors achieve speeds which are, at the very least, on par with conventional signals. However, the latest IO-Link technology offers decisive advantages in process automation systems, although the potential of the digital interface is far from being fully exploited.

Anritsu is proud to announce its participation as Test and Measurement partner in two pioneering demonstrations of 3GPP Rel-17 compliant Non-Terrestrial Network (NTN) technology at the 2025 5GAA meetings in Paris.

A newly discovered silicone variant conducts electricity, thanks to the work of University of Michigan researchers - overturning assumptions that the material class exclusively insulates.

imec is attending the 28th edition of IEEE IITC, held for the first time in Korea, with 17 presentations, of which 14 are first-authored and two invited. The presentations cover a wide spectrum of interconnect innovations, including advanced metallisation schemes, electrical and reliability modelling, and new integration approaches for sub-2nm nodes.