Infineon - EconoPACK + D Family IGBT Modules for Highest Demands Posed by Wind and Solar Systems and Industrial Drives
Infineon Technologies presents the EconoPACK + D family, the latest generation of power semiconductor modules in the 1200V and 1700V voltage classes with up to 450A nominal current, at the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany. Infineon has developed the new EconoPACK™ + D series based on the well-known and established EconoPACK™+ platform to master the ever-growing demands in applications such as renewable energies, commercial vehicles, elevators, industrial drives or power supplies. Thanks to numerous improvements and innovations, such as ultrasonic welded power terminals, an optimized base plate structure or reliable and innovative PressFIT control pin technology, the new modules open the door to implementing rugged and efficient power converter concepts on a small footprint.
“In coming up with EconoPACK™ + D, Infineon offers a trend-setting family of power modules. That’s the case because new generations of chips can unfold their full potential in the module package only if appropriate contact and connection technologies so permit,” says Martin Hierholzer, Vice President and General Manager Industrial Power at Infineon Technologies. “Given the increasing demands particularly in renewables or in electric-powered commercial vehicles, our innovative package concept optimized for system integration clears the way for efficient, robust and compact inverter designs.”
Modules with current ratings of 225A through 450A, with 1200V and 1700V voltage ratings, open the door to developing efficient and compact inverters. Featuring screw power terminals providing excellent electric connection and PressFIT control pins for solderless inverter assembly, the EconoPACK™ + D modules are ideal for an array of industrial applications. The ultrasonic welded power terminals increase the mechanical robustness and permit higher currents. Furthermore, the modules deliver reduced conduction losses, optimized stray inductance and – thanks to the latest chip technologies, IGBT4 – a higher operation junction temperature of max. 150°C and hence a higher I RMS current. Combined with the high IGBT4 power cycling capability, Infineon’s power modules raise the bar.
The control pins of the EconoPACK™ + D series feature the extremely reliable PressFIT design, as widely used in the automotive industry. These press-in contacts can be pressed into the PCB by the user for solderless and hence also leadless assembly, but they can also be soldered into the PCB if necessary. Therefore the new D series can be processed using the standard assembly and solder processes currently available for EconoPACK™ + modules.